參數(shù)資料
型號(hào): FSA1258L8X
廠商: Fairchild Semiconductor
文件頁(yè)數(shù): 10/10頁(yè)
文件大小: 0K
描述: IC SWITCH DUAL SPST 8MICROPAK
產(chǎn)品變化通告: Die Material, Mold Compound Change 03/Oct/2008
標(biāo)準(zhǔn)包裝: 1
功能: 開關(guān)
電路: 2 x SPST - NC/NO
導(dǎo)通狀態(tài)電阻: 1.15 歐姆
電壓電源: 單電源
電壓 - 電源,單路/雙路(±): 1.65 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 8-XFQFN
供應(yīng)商設(shè)備封裝: 8-MicroPak?
包裝: 標(biāo)準(zhǔn)包裝
產(chǎn)品目錄頁(yè)面: 1218 (CN2011-ZH PDF)
其它名稱: FSA1258L8XDKR
2004 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSA1256(A) / FSA1257(A) / FSA1258(A) Rev. 1.0.9
9
FS
A
125
6(
A
)/
F
S
A
125
7(
A
)/
F
S
A
125
8(
A
)
Low
-R
ON
Low
-V
ol
ta
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ua
l
SP
S
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A
na
log
S
wit
c
h
w
it
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Low
-I
CCT
Physical Dimensions
(0.09)
(0.1)
(0.2)
1.6
2X
0.05
0.00
1.6
2X
C
0.05 C
4
3. DRAWING CONFORMS TO ASME Y.14M-1994
2. DIMENSIONS ARE IN MILLIMETERS
1. PACKAGE CONFORMS TO JEDEC MO-255 VARIATION UAAD
BOTTOM VIEW
4. PIN 1 FLAG, END OF PACKAGE OFFSET
MAC08AREV4
1
2
3
5
6
7
8
Notes:
8X
0.25
0.35
3X
8X
1.0
4
0.5
8X
0.25
0.15
0.10
C A B
0.05
C
0.10 C
TOP VIEW
INDEX AREA
B
Recommended Landpattern
A
0.10 C
0.55 MAX
0.05 C
DETAIL A
0.35
0.25
(0.15)
(0.20)
0.35
0.25
DETAIL A
PIN #1 TERMINAL
SCALE: 2X
5. DRAWING FILE NAME: MKT-MAC08AREV4
Figure 17.
8-Lead MicroPak, 1.6 mm Wide
For tape and reel specifications for MicroPak, please visit:
http://www.fairchildsemi.com/products/logic/pdf/micropak_tr.pdf
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
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