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    參數(shù)資料
    型號: FS8853-18PI
    廠商: Electronic Theatre Controls, Inc.
    英文描述: 300mA LDO Linear Regulator
    中文描述: 300mA的LDO線性穩(wěn)壓器
    文件頁數(shù): 9/13頁
    文件大?。?/td> 661K
    代理商: FS8853-18PI
    FS8853
    300mA LDO Linear Regulator
    Fortune Semiconductor Co.
    http://www.fsc.com.tw
    TEL
    : +886-2-2809-4742
    FAX: +886-2-2809-4874
    9/13
    TD-0405006 Rev. 1.5
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    The FS8853 is a low-dropout linear regulator. The
    device provides preset 2.5V and 3.3V output
    voltages for output current up to 300mA. Other
    mask options for special output voltages from 1.3V
    to 4.5V with 100mV increment are also available.
    As illustrated in function block diagram, it consists
    of a 1.25V reference, error amplifier, P-channel
    pass transistor and an internal feedback voltage
    divider.
    The 1.25V bandgap reference is connected to the
    error amplifier, which compares this reference with
    the feedback voltage and amplifies the voltage
    difference. If the feedback voltage is lower than the
    reference voltage, the pass-transistor gate is
    pulled lower, which allows more current to pass to
    the output pin and increases the output voltage. If
    the
    feedback
    voltage
    pass-transistor gate is pulled up to decrease the
    output voltage.
    The output voltage is feedback through an internal
    resistive divider connected to OUT pin. Additional
    blocks include an output current limiter, thermal
    sensor, and shutdown logic.
    Internal P-channel Pass Transistor
    The FS8853 features a P-channel MOSFET pass
    transistor. Unlike similar designs using PNP pass
    transistors, P-channel MOSFETs require no base
    drive,
    which
    reduces
    PNP-based regulators also waste considerable
    current in dropout when the pass transistor
    saturates, and use high base-drive currents under
    large loads. The FS8853 does not suffer from
    these problems and consumes only 65
    μ
    A (Typ.) of
    ground pin current under heavy loads as well as in
    dropout conditions.
    Output Voltage Selection
    The FS8853 output voltage is preset at an
    internally trimmed voltage 2.5V, 3.3V or can be
    mask-optioned from 1.3V to 4.5V with 100mV
    increment. The first two digits of part number suffix
    identify the output voltage (see
    Ordering
    Information
    ). For example, the FS8853-33CL has
    a preset 3.3V output voltage.
    is
    too
    high,
    the
    ground
    pin
    current.
    Current Limit
    The FS8853 also include a fold back current limiter.
    It monitors and controls the pass transistor’s gate
    voltage, estimates the output current, and limits the
    output current within 0.6A.
    Thermal Overload Protection
    Thermal overload protection limits total power
    dissipation in the FS8853. When the junction
    temperature exceeds T
    J
    = +155°C
    ,
    a thermal
    sensor turns off the pass transistor, allowing the IC
    to cool down. The thermal sensor turns the pass
    transistor on again after the junction temperature
    cools down by 20°C
    ,
    resulting in a pulsed output
    during continuous thermal overload conditions.
    Thermal overload protection is designed to protect
    the FS8853 in the event of fault conditions. For
    continuous operation, the maximum operating
    junction temperature rating of T
    J
    = +125°C
    should
    not be exceeded.
    Operating Region and Power Dissipation
    Maximum power dissipation of the FS8853
    depends on the thermal resistance of the case and
    circuit board, the temperature difference between
    the die junction and ambient air, and the rate of
    airflow. The power dissipation across the devices
    is P = I
    OUT
    x (V
    IN
    -V
    OUT
    ). The resulting maximum
    power dissipation is:
    (
    )
    A
    J
    MAX
    P
    θ
    θ
    +
    Where (T
    J
    -T
    A
    ) is the temperature difference
    between the FS8853 die junction and the
    surrounding air,
    θ
    JC
    is the thermal resistance of the
    package chosen, and
    θ
    CA
    is the thermal resistance
    through the printed circuit board, copper traces
    and other materials to the surrounding air. For
    better heat-sinking, the copper area should be
    equally shared between the IN, OUT, and GND
    pins.
    If the FS8853 uses a SOT-89 package and this
    (
    )
    JA
    A
    J
    CA
    JC
    T
    T
    T
    T
    θ
    =
    =
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