參數(shù)資料
型號: FQU60N03L
廠商: FAIRCHILD SEMICONDUCTOR CORP
元件分類: JFETs
英文描述: 30V Logic N-Channel MOSFET(漏源電壓為30V、漏電流為40.3A的邏輯N溝道增強(qiáng)型MOS場效應(yīng)管)
中文描述: 40.3 A, 30 V, 0.024 ohm, N-CHANNEL, Si, POWER, MOSFET
封裝: IPAK-3
文件頁數(shù): 1/9頁
文件大?。?/td> 577K
代理商: FQU60N03L
2000 Fairchild Semiconductor International
April 2000
Rev. A, April 2000
F
QFET
TM
FQD60N03L / FQU60N03L
30V LOGIC N-Channel MOSFET
General Description
These N-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary,
planar stripe, DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the
avalanche and commutation mode. These devices are well
suited for low voltage applications such as DC/DC
converters, and high efficiency switching for power
management in portable and battery operated products.
Features
40.3A, 30V, R
DS(on)
= 0.019
@ V
GS
= 10V
Low gate charge ( typical 18.5 nC)
Low Crss ( typical 155 pF)
Fast switching
100% avalanche tested
Improved dv/dt capability
150
o
C maximum junction temperature rating
Absolute Maximum Ratings
T
C
= 25°C unless otherwise noted
Thermal Characteristics
Symbol
V
DSS
I
D
Parameter
FQD60N03L / FQU60N03L
30
40.3
25.5
161
±
20
220
40.3
5.6
7.0
2.5
56
0.45
-55 to +150
Units
V
A
A
A
V
mJ
A
mJ
V/ns
W
W
W/°C
°C
Drain-Source Voltage
Drain Current
- Continuous (T
C
= 25°C)
- Continuous (T
C
= 100°C)
- Pulsed
I
DM
V
GSS
E
AS
I
AR
E
AR
dv/dt
P
D
Drain Current
Gate-Source Voltage
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Power Dissipation (T
A
= 25°C) *
Power Dissipation (T
C
= 25°C)
(Note 1)
(Note 2)
(Note 1)
(Note 1)
(Note 3)
- Derate above 25°C
T
J
, T
STG
Operating and Storage Temperature Range
Maximum lead temperature for soldering purposes,
1/8 from case for 5 seconds
T
L
300
°C
Symbol
R
θ
JC
R
θ
JA
R
θ
JA
Parameter
Typ
--
--
--
Max
2.25
50
110
Units
°C W
°C W
°C W
Thermal Resistance, Junction-to-Case
Thermal Resistance, Junction-to-Ambient *
Thermal Resistance, Junction-to-Ambient
* When mounted on the minimum pad size recommended (PCB Mount)
! "
!
!
S
!
"
"
"
D
G
I-PAK
FQU Series
D-PAK
FQD Series
G
S
D
G
S
D
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