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參數(shù)資料
| 型號(hào)： | FMS2027 |
| 英文描述： | DC?20 GHZ MMIC SPDT NON-REFLECTIVE SWITCH |
| 中文描述： | 直流？20 GHz單片單刀雙擲無反射開關(guān) |
| 文件頁數(shù)： | 2/4頁 |
| 文件大?。?/td> | 146K |
| 代理商： | FMS2027 |
A
BSOLUTE
M
AXIMUM
R
ATINGS
:
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Fax: +44 (0) 1325 306177
Tel: +44 (0) 1325 301111
Email: sales@filcs.com
Website:
www.filtronic.com
2
Preliminary Datasheet v2.2
FMS2027
Note: Exceeding any one of these absolute
maximum ratings may cause permanent
damage to the device.
P
AD
L
AYOUT
:
Note:
1
Co-ordinates are referenced from the bottom left
hand corner of the die to the centre of bond pad
opening
2
Only one control line A and one control line B
require connection
T
RUTH
T
ABLE
:
Note: -5V
±
0.2V; 0V
±
0.2V
P
ARAMETER
S
YMBOL
A
BSOLUTE
M
AXIMUM
Max Input Power
Pin
+38dBm
Control Voltage
Vctrl
+XV
Operating Temp
Toper
-40°C to +100°C
Storage Temp
Tstor
-55°C to +150°C
C
ONTROL
L
INE
A
RF P
ATH
B
RFIN-RFO1
RFIN-RFO2
-5V
0V
ON
OFF
0V
-5V
OFF
ON
P
AD
N
AME
D
ESCRIPTION
P
IN
C
OORDINATES
(μm)
RFIN
RFIN
(653, 776)
RFO1
RFOUT1
(125, 333)
RFO2
RFOUT2
(125, 776)
A
VA1
(125, 626)
A
VA2
(504, 176)
A
VA3
(807, 176)
A
VA4
(1183, 776)
B
VB1
(125, 776)
B
VB2
(654, 176)
B
VB3
(1183, 626)
RFIN
A
B
A
B
RFO1
RFO2
A B
A
D
IE
S
IZE
(
μ
m)
D
IE
T
HICKNESS
(
μ
m)
M
IN
. B
OND
P
AD
P
ITCH
(
μ
m)
M
IN
. B
OND PAD
O
PENING
(
μ
m x
μ
m )
1910 x 1110 (pizza mask)
1300 x 800 (production mask)
100
150
96 x 96
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