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參數(shù)資料
| 型號(hào)： | FMS2020 |
| 英文描述： | GaAs Multi-Purpose Wide Band SPDT Switch |
| 中文描述： | 砷化鎵多功能寬帶SPDT開(kāi)關(guān) |
| 文件頁(yè)數(shù)： | 4/4頁(yè) |
| 文件大?。?/td> | 214K |
| 代理商： | FMS2020 |
Advanced Product Information
1.1
4
Preliminary specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Contact Details (UK): Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com
Contact Details (USA): Tel: +1 (408) 850 5790 Fax: +1 (408) 850 5766 Email:
sales@filss.com
Website: www.filcs.com
FMS2020
Preferred Assembly Instructions:
GaAs devices are fragile and should be handled with great care. Specially designed collets should be
used where possible.
The back of the die is not metallised and the recommended mounting method is by the use of
conductive epoxy. Epoxy should be applied to the attachment surface uniformly and sparingly to avoid
encroachment of epoxy on to the top face of the die and ideally should not exceed half the chip height.
For automated dispense Ablestick LMISR4 is recommended and for manual dispense Ablestick 84-1
LMI or 84-1 LMIT are recommended. These should be cured at a temperature of 150
°
C for 1 hour in
an oven especially set aside for epoxy curing only. If possible the curing oven should be flushed with
dry nitrogen.
This part has gold (Au) bond pads requiring the use of gold (99.99% pure) bondwire. It is
recommended that 25.4
μ
m diameter gold wire is used. Thermosonic ball bonding is preferred. A
nominal stage temperature of 150
°
C and a bonding force of 40g has been shown to give effective
results for 25
μ
m wire. Ultrasonic energy shall be kept to a minimum. For this bonding technique,
stage temperature should not be raised above 200
°
C and bond force should not be raised above 60g.
Thermosonic wedge bonding and thermocompression wedge bonding can also be used to achieve
good wire bonds.
Bonds should be made from the die first and then to the mounting substrate or package. The physical
length of the bondwires should be minimised especially when making RF or ground connections.
Handling Precautions:
To avoid damage to the devices care should be exercised during handling. Proper Electrostatic
Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and
testing. These devices should be treated as Class 1A (0-500 V) as defined in JEDEC Standard No.
22-A114-B. Further information on ESD control measures can be found in MIL-STD-1686 and MIL-
HDBK-263.
Disclaimers:
This product is not designed for use in any space based or life sustaining/supporting equipment.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| FMS2020-001-EB | GaAs Multi-Purpose Wide Band SPDT Switch |
| FMS2021 | DC- 6 GHz SPDT WLAN GaAs Low Loss Switch |
| FMS2022 | DC?4 GHz MMIC SP4T Absorptive Switch |
| FMS2023 | DC?20 GHZ MMIC LOW LOSS SPST ABSORPTIVE SWITCH |
| FMS2024-000 | DC?20 GHZ MMIC SPDT REFLECTIVE SWITCH |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| FMS2020-001 | 制造商:FILTRONIC 制造商全稱(chēng):FILTRONIC 功能描述:GaAs Multi-Purpose Wide Band SPDT Switch |
| FMS2020-001-EB | 制造商:FILTRONIC 制造商全稱(chēng):FILTRONIC 功能描述:GaAs Multi-Purpose Wide Band SPDT Switch |
| FMS2020QFN | 制造商:FILTRONIC 制造商全稱(chēng):FILTRONIC 功能描述:GaAs Multi-Purpose Wide Band SPDT Switch |
| FMS2021 | 制造商:FILTRONIC 制造商全稱(chēng):FILTRONIC 功能描述:DC- 6 GHz SPDT WLAN GaAs Low Loss Switch |
| FMS2022 | 制造商:FILTRONIC 制造商全稱(chēng):FILTRONIC 功能描述:DC?4 GHz MMIC SP4T Absorptive Switch |
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