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參數(shù)資料
| 型號： | FMA411 |
| 英文描述： | LOW-NOISE X-BAND MMIC |
| 中文描述： | 低噪聲的X波段單片 |
| 文件頁數(shù)： | 2/3頁 |
| 文件大?。?/td> | 227K |
| 代理商： | FMA411 |
PRELIMINARY
FMA411
L
OW
-N
OISE
X-BAND
MMIC
Phone:
+1 408 850-5790
Fax: +1 408 850-5766
www.filcs.com
Revised:
7/19/04
Email:
sales@filcsi.com
ABSOLUTE MAXIMUM RATINGS
1
Parameter
Supply Voltage
Supply Current
RF Input Power
Storage Temperature
Total Power Dissipation
Gain Compression
Simultaneous Combination of Limits
2
1
T
Ambient
= 22
°
C unless otherwise noted
Symbol
V
DD
I
DD
P
IN
T
STG
P
TOT
Comp.
Test Conditions
For any operating current
For V
DD
< 7V
For standard bias conditions
Non-Operating Storage
See De-Rating Note below
Under any bias conditions
2 or more Max. Limits
Min
-40
Max
8
75% I
DSS
0
150
980
5
80
Units
V
mA
dBm
oC
mW
dB
%
2
Users should avoid exceeding 80% of 2 or more Limits simultaneously
Notes
:
Operating conditions that exceed the Absolute Maximum Ratings will result in permanent damage to the device.
Total Power Dissipation defined as: P
TOT
≡
(P
DC
+ P
IN
) – P
OUT
, where:
P
DC
: DC Bias Power
P
IN
: RF Input Power
P
OUT
: RF Output Power
Total Power Dissipation to be de-rated as follows above 22
°
C:
P
TOT
= 0.6 - (0.004W/
°
C) x T
CARRIER
where T
CARRIER
=
carrier or heatsink temperature above 22
°
C
(coefficient of de-rating formula is the Thermal Conductivity)
Example: For a 55
°
C carrier temperature: P
TOT
= 0.6 - (0.004 x (55 – 22)) = 0.47W
For optimum heatsinking eutectic die attach is recommended; conductive epoxy die attach is acceptable with
some degradation in thermal de-rating performance (P
TOT
= 550mW)
Note on Thermal Resistivity:
The nominal value of 250
°
C/W is stated for the input stage, which will reach
temperature limits before the output stage. The aggregate MMIC thermal resistivity is approximately 175
°
C/W.
HANDLING PRECAUTIONS
To avoid damage to the devices care should be exercised during handling. Proper Electrostatic
Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and
testing. These devices should be treated as Class 1A per ESD-STM5.1-1998, Human Body Model.
Further information on ESD control measures can be found in MIL-STD-1686 and MIL-HDBK-263.
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