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參數(shù)資料
| 型號： | FL05RD1R0E |
| 廠商： | TAIYO YUDEN CO LTD |
| 元件分類： | 數(shù)據(jù)傳輸濾波器 |
| 英文描述： | 1 FUNCTIONS, 0.5 A, DATA LINE FILTER |
| 封裝： | ROHS COMPLIANT PACKAGE-2 |
| 文件頁數(shù)： | 10/11頁 |
| 文件大?。?/td> | 210K |
| 代理商： | FL05RD1R0E |
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■ RELIABILITY DATA
＊This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specication.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
18. Resisitance to vibration
LA Type
△L/L : Within ±5% Q : 30min
CAL45 Type
△L/L : Within ±5%
LHL□□□
Appearance : No abnomality
△L/L : Within ±5%
Q change : Within ±30% (LHLP : only △L/L)
FBA/FBR
Appearance : No abnomality
Impedance change : Within ±20%
FL05□ Type
FL06BT Type
【Test Method and Remarks】
LA, CA
: Directions
: 2 hrs each in X, Y and Z directions total : 6hrs.
Frequency range : 10 to 55 to 10Hz (1min.)
Amplitude
: 1.5mm
Mounting method : Soldering onto printed board.
Recovery
: At least 1hr of recovery under the standard condition after the test, followed by the measurement within 2hrs.
LHL□□□·FB：Directions
: 2 hrs each in X, Y and Z directions total : 6hrs.
Frequency range : 10 to 55 to 10Hz (1min.)
Amplitude
: 1.5mm (But don't exceed acceleration 196m/s2 (two power))
Mounting method : Soldering onto printed board.
19. Resistance to shock
LA Type
No signicant abnormality in appearance
CAL45 Type
LHL□□□
FBA/FBR
FL05□ Type
FL06BT Type
【Test Method and Remarks】
LA, CA
:
Drop test
Impact material : concrete or vinyl tile
Height : 1m
Total number of drops : 10 times
20. Solderability
LA Type
At least 75％ of terminal electrode is covered by new solder.
CAL45 Type
LHL□□□
At least 75％ of terminal electrode is covered by new solder.
FBA/FBR
At least 90％ of terminal electrode is covered by new solder.
FL05□ Type
At least 75％ of terminal electrode is covered by new solder.
FL06BT Type
【Test Method and Remarks】
LA, CA
: Solder temperature : 230±5℃
Duration
: 2±0.5 sec.
LHL□□□ : Solder temperature : 235±5℃
Duration
: 2±0.5 sec.
Immersion depth
: Up to 1.5mm from bottom of case.
FB
: Solder temperature : 230±5℃
Duration
: 3±1 sec.
Immersion depth
: Up to 1.5mm from terminal root.
FL05R□
: Solder temperature : 230±5℃
Duration
: 2±0.5 sec.
Immersion depth
: Up to 2 to 2.5mm from terminal root.
FL06BT
: Solder temperature : 230±5℃
Duration
: 3±1 sec.
Immersion depth
: Up to 0.5 to 1.0mm from terminal root.
21. Resisitance to soldering heat
LA Type
No signicant abnormality in appearance
CAL45 Type
△L/L : Within ±5%
LHL□□□
No signicant abnormality in appearance
Inductance change : Within ±5%
Q change : Within ±30%(LHLP : only △L/L)
FBA/FBR
No signicant abnormality in appearance
Impedance change : Within ±20%
FL05□ Type
Refer to individual specication
FL06BT Type
No signicant abnormality in appearance
Impedance change : Within ±20%
【Test Method and Remarks】
LA, CA
: Solder temperature
: (CA) 270±5℃, (LA) 260±5℃
Duration
: 5±0.5 sec. One time
Immersed conditions : Inserted into substrate with t=1.6mm
Recovery
: At least 1hr of recovery under the standard condition after the test, followed by the measurement within 2hrs.
LHL□□□ : Solder bath method : Solder temperature : 260±5℃
Duration
: 10±1 sec.
Up to 1.5mm from the bottom of case.
Manual soldering
: Solder temperature : 350±10℃ (At the tip of soldering iron)
Duration
: 5±1 sec.
Up to 1.5mm from the bottom of case.
Caution
: No excessive pressing shall be applied to terminals.
Recovery
: 4 to 24hrs of recovery under the standard condition after the test.
FB
: Solder bath method : Condition 1 : Solder temperature : 260±5℃
Duration
: 10±1 sec.
Immersion depth
: Up to 1.5mm from the terminal root.
Condition 2 : Solder temperature : 350±5℃
Duration
: 3±1 sec.
Immersion depth
: Up to 1.5mm from the terminal root.
Recovery
: 3hrs of recovery under the standard condition after the test.
FL
: Solder condition
: 260±5℃
10±1 sec.
Immersion depth
: Up to 0.5 to 1.0mm from the terminal root.
Recovery
: 3hrs of recovery under the standard condition after the test.
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| FL05RD1R0ET | 功能描述:電磁干擾濾波珠子、扼流圈和陣列 WND TORROIDS/BD S 1.0+1.0/-0.5uH RoHS:否 制造商:AVX 阻抗: 最大直流電流:35 mA 最大直流電阻: 容差: 端接類型:SMD/SMT 電壓額定值:25 V 工作溫度范圍:- 25 C to + 85 C 封裝 / 箱體:0603 (1608 metric) |
| FL05RD1R0EZ | 功能描述:電磁干擾濾波珠子、扼流圈和陣列 WND TORROIDS/BD S 1.0+1.0/-0.5uH RoHS:否 制造商:AVX 阻抗: 最大直流電流:35 mA 最大直流電阻: 容差: 端接類型:SMD/SMT 電壓額定值:25 V 工作溫度范圍:- 25 C to + 85 C 封裝 / 箱體:0603 (1608 metric) |
| FL05RD200A | 功能描述:電磁干擾濾波珠子、扼流圈和陣列 WND TORROIDS/BD S 20MIN uH RoHS:否 制造商:AVX 阻抗: 最大直流電流:35 mA 最大直流電阻: 容差: 端接類型:SMD/SMT 電壓額定值:25 V 工作溫度范圍:- 25 C to + 85 C 封裝 / 箱體:0603 (1608 metric) |
| FL05RD200AT | 功能描述:電磁干擾濾波珠子、扼流圈和陣列 WND TORROIDS/BD S 20MIN uH RoHS:否 制造商:AVX 阻抗: 最大直流電流:35 mA 最大直流電阻: 容差: 端接類型:SMD/SMT 電壓額定值:25 V 工作溫度范圍:- 25 C to + 85 C 封裝 / 箱體:0603 (1608 metric) |
| FL05SERIES | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Low Cost High Pass Filters |
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