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參數(shù)資料
| 型號(hào)： | FI212L062009-T |
| 廠商： | TAIYO YUDEN CO LTD |
| 元件分類： | 數(shù)據(jù)傳輸濾波器 |
| 英文描述： | 1 FUNCTIONS, FERRITE CHIP |
| 文件頁(yè)數(shù)： | 2/10頁(yè) |
| 文件大小： | 785K |
| 代理商： | FI212L062009-T |
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■ PRECAUTIONS
＊This catalog contains the typical specication only due to the limitation of space. When you consider purchase of our products, please check our specication.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
1. PCB Design
Technical
consider-
ations
◆Land pattern design
Land pattern dimension examples
0.50
0.25
0.55
0.30
0.2
0.45
0.7
0.3
0.2
0.45
0.05
2. Soldering
Technical
consider-
ations
◆Conditions for Reow soldering (for reference)
【Reow Prole】
3. Storage conditions
Precautions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control temperature and hu-
midity in the storage area. Humidity should especially be kept as low as possible.
·Recommended conditions
Ambient temperature : ー20～＋35℃
Humidity
: Below 60%RH
The ambient temperature must be kept below 30℃.
Even under ideal storage conditions lter electrode solderabitlity decreases as time passes, so lter should be used within 6 months from the time of deliv-
ery.
·The packaging material should be kept where no chlorine or sulfur exists in the air.
Technical
consider-
ations
◆Storage
1. If the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes
and deterioration of taping/ packaging materials may take place. For this reason, components should be used within 6 months from the time of delivery. If
exceeding the above period, please check solderability before using the lter.
■ Please contact of our ofces for further details of specications.
All of the standard values listed here are subject to change without notice.
Therefore,please check the specications carefully before use.
FI212B Type
FI212B245021/FI212B190223
FI168B/L Type
FI168T Type
FI212C Type
FI212P Type
FI105B/L Type
FI212L Type
Unit : mm
※ Components should be preheated to within
100 to 130℃ from soldering temperature.
※ Assured to be reow soldering for 2 times.
Note : The above proles are the maximum allow-
able soldering condition, therefore these
proles are not always recommended.
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| FIS-21.4 | 21.4 MHz, BAND PASS FILTER |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| FI212P082931-T | 功能描述:RF Diplexor 698MHz ~ 960MHz / 1.42GHz ~ 2.69GHz 0805 (2012 Metric), 6 PC Pad 制造商:taiyo yuden 系列:- 包裝:剪切帶（CT） 零件狀態(tài):有效 頻帶（低/高）:698MHz ~ 960MHz / 1.42GHz ~ 2.69GHz 低頻帶衰減（最小/最大 dB）:13.00dB / - 高頻帶衰減（最小/最大 dB）:13.00dB / - 回波損耗（低頻帶/高頻帶）:- 安裝類型:表面貼裝 封裝/外殼:0805（2012 公制），6 PC 板 標(biāo)準(zhǔn)包裝:1 |
| FI212P082934-T | 功能描述:RF Diplexor 698MHz ~ 960MHz / 1.554GHz ~ 7.83GHz 0805 (2012 Metric), 6 PC Pad 制造商:taiyo yuden 系列:- 包裝:剪切帶（CT） 零件狀態(tài):有效 頻帶（低/高）:698MHz ~ 960MHz / 1.554GHz ~ 7.83GHz 低頻帶衰減（最小/最大 dB）:15.00dB / - 高頻帶衰減（最小/最大 dB）:25.00dB / - 回波損耗（低頻帶/高頻帶）:- 安裝類型:表面貼裝 封裝/外殼:0805（2012 公制），6 PC 板 標(biāo)準(zhǔn)包裝:1 |
| FI212P085909-T | 功能描述:RF Diplexor 698MHz ~ 960MHz / 1.558GHz ~ 1.61GHz 0805 (2012 Metric) 制造商:taiyo yuden 系列:- 包裝:剪切帶（CT） 零件狀態(tài):有效 頻帶（低/高）:698MHz ~ 960MHz / 1.558GHz ~ 1.61GHz 低頻帶衰減（最小/最大 dB）:25.00dB / - 高頻帶衰減（最小/最大 dB）:19.00dB / - 回波損耗（低頻帶/高頻帶）:- 安裝類型:表面貼裝 封裝/外殼:0805（2012 公制） 標(biāo)準(zhǔn)包裝:1 |
| FI212P085912-T | 功能描述:RF Diplexor 698MHz ~ 960MHz / 1.558GHz ~ 1.61GHz 0805 (2012 Metric) 制造商:taiyo yuden 系列:- 包裝:剪切帶（CT） 零件狀態(tài):有效 頻帶（低/高）:698MHz ~ 960MHz / 1.558GHz ~ 1.61GHz 低頻帶衰減（最小/最大 dB）:25.00dB / - 高頻帶衰減（最小/最大 dB）:19.00dB / - 回波損耗（低頻帶/高頻帶）:- 安裝類型:表面貼裝 封裝/外殼:0805（2012 公制） 標(biāo)準(zhǔn)包裝:1 |
| FI212P089208-T | 功能描述:信號(hào)調(diào)節(jié) DIPLEXER FLTR HI FREQ MULTILYR RoHS:否 制造商:EPCOS 產(chǎn)品:Duplexers 頻率:782 MHz, 751 MHz 頻率范圍: 電壓額定值: 帶寬: 阻抗:50 Ohms 端接類型:SMD/SMT 封裝 / 箱體:2.5 mm x 2 mm 工作溫度范圍:- 30 C to + 85 C 封裝:Reel |
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