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參數(shù)資料
| 型號： | FH26-51S-0.3SHW |
| 廠商： | Hirose Electric USA, INC. |
| 英文描述： | 0.3mm Contact Pitch, 1mm above the board, Flexible Printed Circuit ZIF Connectors |
| 中文描述： | 0.3毫米間距聯(lián)系，高于板，柔性線路板連接器1mm的中頻 |
| 文件頁數(shù)： | 7/16頁 |
| 文件大?。?/td> | 652K |
| 代理商： | FH26-51S-0.3SHW |
7
B
Recommended Temperature Profile
G
Using Typical Solder Paste
HRS test conditions
Solder method
:Reflow, IR/hot air
(Nihon Den-netsu Co., Ltd.'s
Part Number: SENSBY NR-
2
)
:Room air
:Paste, 63%Sn/37%Pb
(Senju Metal Industry, Co., Ltd.'s
Part Number: OZ63-201C-50-9)
:
Glass epoxy 25mm
∞
50mm
∞
0.8mm thick
:0.3mm∞0.65mm,0.3mm∞0.8mm
:0.23∞0.55∞0.1mm thick,
0.23∞0.65∞0.1mm thick
Environment:
Solder composition:
Test board
Land dimensions
Metal mask
The temperature profiles are based on the above conditions.
In individual applications the actual temperature may
vary,depending on solder paste type, volume/thickness and
board size/thickness. Consult your solder paste and
equipment manufacturer for specific recommendations.
HRS test conditions
Solder method
:Reflow, IR/hot air
(Nihon Den-netsu Co., Ltd.'s
Part Number: SENSBY NR-NR-
2
)
:Room air
:Paste, 96.5%Sn/3.0%Ag/0.5%Cu
(Senju Metal Industry, Co., Ltd.'s
Part Number: M705-221CM5-42-10.5)
:
Glass epoxy 25mm
∞
50mm
∞
0.8mm thick
:0.3mm
∞
0.65mm, 0.3mm
∞
0.8mm
:0.23
∞
0.55
∞
0.1mm thick,
0.23
∞
0.65
∞
0.1mm thick
Environment
Solder composition
Test board
Land dimensions
Metal mask
The temperature profiles are based on the above conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume/thickness and board
size/thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.
G
Using Lead-free Solder Paste
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| FH26-71S-0.3SHW | Style B Plastibox Enclosure; Enclosure Material:Plastic; External Height:2.45"; External Width:4.88"; External Depth:6.88"; Enclosure Color:Black; External Body Height:0.70"; Internal Body Height:2.25"; Internal Depth:6.48" RoHS Compliant: Yes |
| FH26-57S-0.3SHW | 0.3mm Contact Pitch, 1mm above the board, Flexible Printed Circuit ZIF Connectors |
| FH26-27S-0.3SHW | 0.3mm Contact Pitch, 1mm above the board, Flexible Printed Circuit ZIF Connectors |
| FH26-33S-0.3SHW | 0.3mm Contact Pitch, 1mm above the board, Flexible Printed Circuit ZIF Connectors |
| FH26-23S-0.3SHW | 0.3mm Contact Pitch, 1mm above the board, Flexible Printed Circuit ZIF Connectors |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| FH-26553-000 | 功能描述:揚聲器與變頻器 5.09 X 2.80 X 2.59MM 100 SENS, 12S PORT RoHS:否 制造商:PUI Audio 產(chǎn)品:Speakers 類型:Electromagnetic 頻率:900 Hz to 12 kHz 聲壓級:88 dBA 阻抗:8 Ohms 功率額定值:1.2 W 形狀:Round 端接類型:Solder Pad 直徑:15 mm 長度: 寬度: 深度:4.4 mm 磁體材料:Neodymium Iron Boran (NdFeB) 圓錐體材料:Mylar |
| FH-26555-000 | 功能描述:揚聲器與變頻器 5.09 X 2.80 X 2.59MM 100 SENS, 12S PORT RoHS:否 制造商:PUI Audio 產(chǎn)品:Speakers 類型:Electromagnetic 頻率:900 Hz to 12 kHz 聲壓級:88 dBA 阻抗:8 Ohms 功率額定值:1.2 W 形狀:Round 端接類型:Solder Pad 直徑:15 mm 長度: 寬度: 深度:4.4 mm 磁體材料:Neodymium Iron Boran (NdFeB) 圓錐體材料:Mylar |
| FH26-55S-0.3SHW | 制造商:HRS 制造商全稱:HRS 功能描述:0.3mm Contact Pitch, 1mm above the board, Flexible Printed Circuit ZIF Connectors |
| FH26-55S-0.3SHW(05) | 功能描述:FFC & FPC連接器 55POS .3MM HORZ SMT RoHS:否 制造商:JAE Electronics 產(chǎn)品類型:Plugs 系列:HD 節(jié)距:0.5 mm 位置/觸點數(shù)量:40 安裝角: 安裝風格:Cable 外殼材料:Plastic 觸點材料:Copper Alloy 觸點電鍍:Gold 電壓額定值:100 V per contact 電流額定值:0.24 A to 1 A |
| FH26-55S-0.3SHW(10) | 功能描述:FFC & FPC連接器 55P F SOCKET SMT HORIZONTAL MOUNTING RoHS:否 制造商:JAE Electronics 產(chǎn)品類型:Plugs 系列:HD 節(jié)距:0.5 mm 位置/觸點數(shù)量:40 安裝角: 安裝風格:Cable 外殼材料:Plastic 觸點材料:Copper Alloy 觸點電鍍:Gold 電壓額定值:100 V per contact 電流額定值:0.24 A to 1 A |
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