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參數(shù)資料
| 型號(hào)： | FFE1070MA11UXL |
| 英文描述： | 10.7 MHz, CERAMIC BPF |
| 封裝： | ROHS COMPLIANT, CERAMIC PACKAGE-3 |
| 文件頁數(shù)： | 3/3頁 |
| 文件大?。?/td> | 53K |
| 代理商： | FFE1070MA11UXL |
(2/2)
002-01 / 20070815 / ef12_ffe.fm
All specifications are subject to change without notice.
ELECTRICAL CHARACTERISTICS
Group delay time: 0.50max.
RELIABILITY AND TEST CONDITIONS
The following test items are satisfied.
(1) Center frequency: Within ±30kHz
(2) 3dB band width: Within ±20kHz
(3) 20dB band width: Within ±30kHz
(4) Insertion loss: Within ±2dB
(5) Attenuation: 25dB min.
SOLDERABILITY
The lead wires are adopted Pb free plating wire to apply Pb free
soldering. You can also use current Sn-Pb eutectic solder.
RECOMMENDED SOLDERING CONDITIONS
This is the fit product for flow soldering.
FLOW SOLDERING CONDITION
Part No.
3dB band width
(kHz)
20dB band width
(kHz)max.
Insertion loss
(dB)max.
SPR attenuation
(dB)min.
Standard type
FFE1070MA11UXL
280±50
600
6.0
35
FFE1070NA11UXL
230±50
570
6.0
35
FFE1070MS11SBL
180±40
520
7.0
35
FFE1070MJ11FBL
150±40
400
10.0
35
Low loss type
FFE1070MA11UAL
280±50
600
5.0
35
FFE1070NA11UAL
230±50
570
4.5
35
FFE1070MS11SAL
180±40
520
5.0
35
FFE1070MJ11FAL
150±40
400
7.0
35
Group delay time control type
FFE1070NA10UGL
230±50
570
6.0
35
FFE1070MS10SGL
180±40
520
7.0
35
Test items
Test conditions
Low temperature
storage characteristics
Temperature: –40±3°C
Time: 100h
High temperature
storage characteristics
Temperature: +85±2°C
Time: 100h
Humidity resistance
Loading: DC.5V(between in/out and
ground terminal)
Humidity: 90 to 95(%)RH
Temperature: 60±2°C
Time: 100h
Thermal shock
–40°C (30min), 85°C (30min) x 5 cycles
Soldering heat resistance
Solder temperature: peak 260°C, 10s flow
Drop
Drop 3 times onto a hard wooden board
from a height of 1m
Vibration
Frequency: 10
55 10Hz/Ampli-
tude: 1.5mm
X, Y and Z directions for 2h each
Test conditions
Test result
With Rosin-methanol 25% by weight, dip in Sn-Pb
eutectic solder bath at 230±5°C for 3±0.5sec. or
Pb free solder(Sn-3Ag-0.5Cu) bath at 245±2°C
for 3±0.2sec.
95% minimum of
surface should be
covered by new solder.
Heat-resistant temperature
260±5°C
Heat-resistant time
10±1sec.
Number of times
1time
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| FFE1070MS11SAL | 10.7 MHz, CERAMIC BPF |
| FFE1070MS11SBL | 10.7 MHz, CERAMIC BPF |
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