參數(shù)資料
型號(hào): FC100V10A
廠商: POWER-ONE INC
元件分類: 模擬信號(hào)調(diào)理
英文描述: SPECIALTY ANALOG CIRCUIT, DMA5
文件頁(yè)數(shù): 9/18頁(yè)
文件大小: 744K
代理商: FC100V10A
REV. AUG 26, 2005
Page
17 of 18
www.power-one.com
FC Filter Series
5A, 10A, 20A Filter Data Sheet
PRINTED CIRCUIT BOARD DESIGN
For optimum filtering, all shunt capacitors which are used in either the input or output circuits must be wired with "Four- Terminal"
techniques. Traces enter the node of the capacitor on one side of its pad (surface mount or discrete) and depart from the other
side. Capacitors are never "Tee'd" from other traces. The traces feeding the capacitors should be close together and parallel.
Never leave large loops in input (or output) and return traces in the printed circuit board designs for power converters. Large
loops form large antennas; large antennas create the most radiated EMI.
It is recommended that one layer of the board which carries the filter and converter(s) be dedicated as a ground plane.
Preferably, this is the layer directly under the modules. It should extend out beyond the edges of the modules. The ground plane
should be connected to earth ground, or to +Vin.
MANUFACTURING ISSUES
Processing of Completed Power Modules
The incorporation of completed power modules into assemblies, or installation into mother boards, can be handled by the
conventional industry methods. The stanchions which are fabricated of PPS plastic, along with all the other component parts
used, will withstand normal preheat temperatures associated with standard soldering operations. The most common method for
mass soldering of the power supply to a mother board is “wave soldering” and should be profiled approximately as follows:
1. The solder pot should be set at 500 °F and the conveyor should have a speed preset to insure that each section of the bottom
side of the assembly dwells in the molten solder wave for 3 to 4 seconds. It is imperative that a correct temperature profile be
used, not only to reduce solder defects but to eliminate any chance of thermal shock on the components.
2. The motherboard should attain a top side preheat temperature of 220° to 240° F before it enters the solder wave. The
temperature change between the preheat and the soldering zones should be minimized.
3. The cooling rate after the solder wave should be similar in drop in temperature to the preheat rise.
Notes on Processing of Completed Power Modules
Power-One through-hole pins are tin/lead plated and are easily soldered if all process parameters are met. However, in
fluxing, the flux density, the activity and the ratio of flux foam to wave height must be closely monitored and controlled to
maintain minimum solder defects.
In controlling the solder profile, preheating of the assembly in two or three stages minimizes the thermal shock damage and
increases the end life of the unit.
If the power converters are to be hand soldered into the motherboard, a temperature controlled iron of 700° F (MAX) is
recommended.
While Power-One power converters generally spend about 3 seconds in the wave, they are designed to withstand soldering
temperatures of 500° F for up to 10 seconds.
If non-conventional methods are to be used to solder Power-One power supplies to the motherboard, contact Power-One
Technical Support before proceeding.
NUCLEAR AND MEDICAL APPLICATIONS - Power-One products are not designed, intended for use in, or authorized for use as critical
components in life support systems, equipment used in hazardous environments, or nuclear control systems without the express written consent
f the respective divisional president of Power-One, Inc.
o
TECHNICAL REVISIONS - The appearance of products, including safety agency certifications pictured on labels, may change depending on the
date manufactured. Specifications are subject to change without notice.
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