Philips Semiconductors
Product specification
FB2040A
8-bit Futurebus+ transceiver
1995 May 25
7
DC ELECTRICAL CHARACTERISTICS
Over recommended operating free-air temperature range unless otherwise noted.
SYMBOL
PARAMETER
TEST CONDITIONS
1
LIMITS
TYP
2
UNIT
MIN
MAX
I
OH
I
OFF
V
OH
High level output current
B0 – B7
V
CC
= MAX, V
IL
= MAX, V
IH
= MIN, V
OH
= 2.1V
V
CC
= 0.0V, V
IL
= MAX, V
IH
= MIN, V
OH
= 2.1V
V
CC
= MIN, V
IL
= MAX, V
IH
= MIN, I
OH
= -3mA
V
CC
= MIN, V
IL
= MAX, V
IH
= MIN, I
OL
= 24mA
V
CC
= MIN, V
IL
= MAX, V
IH
= MIN, I
OL
= 80mA
V
CC
= MIN, V
IL
= MAX, V
IH
= MIN, I
OL
= 100mA
V
CC
= MIN, I
I
= I
IK
100
μ
A
μ
A
Power-off output current
B0 – B7
AO0 – AO7
3
AO0 – AO7
3
100
High-level output voltage
2.5
2.85
V
0.33
0.5
V
OL
Low-level output voltage
B0 – B7
.75
1.0
1.10
V
1.15
V
IK
Input clamp voltage
-1.2
V
I
I
Input current at maximum
input voltage
OEB0, OEB1,
OEA, AI0–AI7
V
CC
= MAX, V
I
= GND or 5.5V
±
50
μ
A
I
IH
High-level input current
High level in ut current
OEB0, OEB1,
OEA, AI0–AI7
V
CC
= MAX, V
I
= 2.7V
20
μ
A
B0 – B7
V
CC
= MAX, V
I
= 2.1V
100
I
IL
Low-level input current
Low level in ut current
OEB0, OEB1,
OEA, AI0–AI7
V
CC
= MAX, V
I
= 0.5V
-20
μ
A
B0 – B7
V
CC
= MAX, V
I
= 0.75V
V
CC
= MAX, V
O
= 2.7V
V
CC
= MAX, V
O
= 0.5V
-100
I
OZH
I
OZL
Off-state output current
AO0 – AO7
50
μ
A
μ
A
Off-state output current
AO0 – AO7
-50
I
OS
Short-circuit output
current
4
AO0 – AO7
only
V
CC
= MAX, V
O
= 0.0V
-30
-150
mA
I
CCZ
(standby)
I
CCB,
AIn to
Bn
V
CC
= MAX
19
30
V
CC
= MAX, outputs Low or High
40
60
I
CC
Supply current (total)
I
CCA,
Bn to
AOn
V
CC
= MAX, outputs Low
22
35
mA
I
Bn to
AOn
V
CC
= MAX, outputs High
19
35
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operation conditions for the applicable type.
2. All typical values are at V
CC
= 5V, T
A
= 25
°
C.
3. Due to test equipment limitations, actual test conditions are V
IH
= 1.8V and V
IL
= 1.3V for the B side.
4. Not more than one output should be shorted at a time. For testing I
OS
, the use of high-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged
shorting of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In
any sequence of parameter tests, I
OS
should be performed last.