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參數(shù)資料
| 型號(hào)： | FB1A3M |
| 廠商： | NEC Corp. |
| 英文描述： | COMPOUND TRANSISTOR |
| 中文描述： | 復(fù)合晶體管 |
| 文件頁(yè)數(shù)： | 6/8頁(yè) |
| 文件大?。?/td> | 111K |
| 代理商： | FB1A3M |
Data Sheet D16180EJ1V0DS
6
FB1 SERIES
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC sales representative.
Surface MOUNTING TYPE
For details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting
Technology Manual (C10535E).
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 230
°
C, Time: 30 sec. max. (at 210
°
C or higher),
Count: Once, Exposure limit: None *
IR30-00
VPS
Package peak temperature: 215
°
C, Time: 40 sec. max. (at 200
°
C or higher),
Count: Once, Exposure limit: None *
VP15-00
Partial heating
Pin temperature: 300
°
C max., Time: 10 sec. max. Exposure limit: None *
O
* After opening the dry pack, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
Cautions 1. Do not use different soldering methods together (except for partial heating).
2. Prevent the resin surface temperature from being higher than the board temperature by 20
°
C or
more.
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| FB1A4A | 制造商:NEC 制造商全稱:NEC 功能描述:COMPOUND TRANSISTOR |
| FB1A4M | 制造商:NEC 制造商全稱:NEC 功能描述:COMPOUND TRANSISTOR |
| FB1A4M-T1B | 制造商:NEC 制造商全稱:NEC 功能描述:COMPOUND TRANSISTOR |
| FB1A4M-T1B-A | 制造商:Renesas Electronics 功能描述:NPN 25V 700mA 制造商:Renesas Electronics 功能描述:NPN 25V 700mA Cut Tape |
| FB1F3P | 制造商:NEC 制造商全稱:NEC 功能描述:COMPOUND TRANSISTOR |
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