參數(shù)資料
型號: EXB2HV471JV
英文描述: FEU CPL 0031.1801 + 0031.1811
中文描述: 片式電阻陣列
文件頁數(shù): 9/10頁
文件大小: 105K
代理商: EXB2HV471JV
Subject
Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION
Spec. No.
151-EXB-28V02DE
Part No.
EXB28V
9-8
MATSUSHITA ELECTRONIC COMPONENTS Co.,LTD.
1.
Application Range
This specification covers taping specification of EXB28V Type.
2. Physical Dimensions
2-1. Stracture and reel dimensions shall be as shown in the figure below.
180
11.4
±1.0
9.0
±1.0
60m
in
.
0 -3
Unit:mm
13.0
±1.
0
Carrier Tape(Paper)
Top Tape
Adhesive Tape
2-2. Carrier Tape Dimensions
Sprocket hole
Chip hole
P1
P0
P2
A
φD0
E
W
F
T
B
Chip resistor array
AB
W
F
E
(mm)
1.20
±0.05
2.20
±0.10
8.00
±0.20
3.50
±0.05
1.75
±0.10
P1
P2
P0
T
φD0
(mm)
2.00
±0.10
2.00
±0.05
4.00
±0.10
0.52
±0.05
1.50
3. Specification
3-1.Taping
When the test shall be operated with the below conditions, peel strength should be 0.049N to
0.49N, should not have flash and tear after peeling.
<Test Method>
Minimum Bending Radius
When carrier tape shall be bent by minimum bending radius (15 mm), no defection of chip and
no break of carrier tape. However minimum bending radius shall be tested for 1 times.
+0.10
0
Peeling Direction
Top Tape
10
°
Carrier Tape
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