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參數(shù)資料
| 型號(hào)： | EVAL-SSM2375Z |
| 廠商： | Analog Devices Inc |
| 文件頁(yè)數(shù)： | 6/16頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | BOARD EVALUATION FOR SSM2375 |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 放大器類型： | D 類 |
| 輸出類型： | 1-通道（單聲道） |
| 在某負(fù)載時(shí)最大輸出功率 x 通道數(shù)量： | 3.7W x 1 @ 3 歐姆 |
| 電源電壓： | 2.5 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 85°C |
| 板類型： | 完全填充 |
| 已用 IC / 零件： | SSM2375 |
| 已供物品： | 板 |
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SSM2375
Data Sheet
Rev. A | Page 14 of 16
OUTPUT > 0V
+5V
0V
OUT+
+5V
0V
OUT–
+5V
0V
VOUT
OUTPUT < 0V
+5V
0V
OUT+
+5V
0V
OUT–
0V
–5V
VOUT
OUTPUT = 0V
OUT+
+5V
0V
+5V
0V
OUT–
+5V
–5V
0V
VOUT
09011-
009
Figure 35. Three-Level, Σ-Δ Output Modulation With and Without Input Stimulus
LAYOUT
As output power increases, care must be taken to lay out PCB
traces and wires properly among the amplifier, load, and power
supply. A good practice is to use short, wide PCB tracks to
decrease voltage drops and minimize inductance. The PCB
layout engineer must avoid ground loops where possible to
minimize common-mode current associated with separate paths
to ground. Ensure that track widths are at least 200 mil for every
inch of track length for lowest DCR, and use 1 oz or 2 oz copper
PCB traces to further reduce IR drops and inductance. A poor
layout increases voltage drops, consequently affecting efficiency.
Use large traces for the power supply inputs and amplifier outputs
to minimize losses due to parasitic trace resistance.
Proper grounding guidelines help to improve audio performance,
minimize crosstalk between channels, and prevent switching
noise from coupling into the audio signal. To maintain high
output swing and high peak output power, the PCB traces that
connect the output pins to the load, as well as the PCB traces to
the supply pins, should be as wide as possible to maintain the
minimum trace resistances. It is also recommended that a large
ground plane be used for minimum impedances.
In addition, good PCB layout isolates critical analog paths from
sources of high interference. High frequency circuits (analog
and digital) should be separated from low frequency circuits.
Properly designed multilayer PCBs can reduce EMI emissions
and increase immunity to the RF field by a factor of 10 or more,
compared with double-sided boards. A multilayer board allows
a complete layer to be used for the ground plane, whereas the
ground plane side of a double-sided board is often disrupted by
signal crossover.
INPUT CAPACITOR SELECTION
The SSM2375 does not require input coupling capacitors if the
input signal is biased from 1.0 V to VDD 1.0 V. Input capacitors
are required if the input signal is not biased within this recom-
mended input dc common-mode voltage range, if high-pass
filtering is needed, or if a single-ended source is used. If high-
pass filtering is needed at the input, the input capacitor and the
input resistor of the SSM2375 form a high-pass filter whose
corner frequency is determined by the following equation:
fC = 1/(2π × RIN × CIN)
The input capacitor can significantly affect the performance of
the circuit. Not using input capacitors degrades both the output
offset of the amplifier and the dc PSRR performance.
POWER SUPPLY DECOUPLING
To ensure high efficiency, low total harmonic distortion (THD),
and high PSRR, proper power supply decoupling is necessary.
Noise transients on the power supply lines are short-duration
voltage spikes. These spikes can contain frequency components
that extend into the hundreds of megahertz. The power supply
input must be decoupled with a good quality, low ESL, low ESR
capacitor, with a minimum value of 4.7 F. This capacitor
bypasses low frequency noises to the ground plane. For high
frequency transient noises, use a 0.1 F capacitor as close as
possible to the VDD pin of the device. Placing the decoupling
capacitors as close as possible to the SSM2375 helps to maintain
efficient performance.
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