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參數(shù)資料
| 型號： | EV34C3B3A1-16.384MTR |
| 廠商： | ECLIPTEK CORP |
| 元件分類： | XO, clock |
| 英文描述： | VCXO, CLOCK, 16.384 MHz, LVCMOS OUTPUT |
| 封裝： | ROHS COMPLIANT, CERAMIC, SMD, 6 PIN |
| 文件頁數(shù)： | 2/2頁 |
| 文件大小： | 133K |
| 代理商： | EV34C3B3A1-16.384MTR |
MANUFACTURER
CATEGORY
SERIES
PACKAGE
VOLTAGE
CLASS
REV
.DATE
ECLIPTEK CORP.
OSCILLATOR
EV34C3
CERAMIC
2.5V
OS7H
09/09
EV34C3 B 3 A 1 - 35.328M TR
OPERATING TEMPERATURE RANGE
A=0°C to +70°C,
B=-40°C to +85°C
ABSOLUTE PULL RANGE (APR)
3=±50ppm Minimum
4=±80ppm Minimum,
5=±100ppm Minimum
LINEARITY
A=10% Typical, 20% Maximum
PART NUMBERING GUIDE
A
B
C
D
E
F
16±.3-.1
7.5±.1
6.75±.1
4 ±.1
2±.1
F
G
H
J
K
L
8±.1
B0*
1.5 +.1-0
A0*
.3 ±.05
K0*
TAPE
M
N
O
P
Q
1.5 MIN
50 MIN
20.2 MIN
13±.2
40 MIN
R
S
T
U
V
QTY/REEL
2.5 MIN
10 MIN
22.4 MAX
360 MAX
16.4+2-0
1,000
REEL
*Compliant to EIA 481A
MECHANICAL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
MARKING SPECIFICATIONS
ENVIRONMENTAL/MECHANICAL SPECIFICATIONS
SUGGESTED SOLDER PAD LAYOUT
ALL DIMENSIONS IN MILLIMETERS
TAPE AND REEL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
Tolerances= +0.1
Line 1: ECLIPTEK
Line 2: XX.XXX M
Frequency in MHz (5 Digits Maximum + Decimal)
Line 3: XX Y ZZ
Week of Year
Last Digit of Year
Ecliptek Manufacturing Identifier
800-ECLIPTEK www.ecliptek.com for latest revision
Specifications subject to change without notice.
Pin 1: Control Voltage (V
C)
Pin 2: No Connect
Pin 3: Case Ground
Pin 4: Output
Pin 5: Tri-State
Pin 6: Supply Voltage
AVAILABLE OPTIONS
Blank=Bulk (Standard)
TR=Tape and Reel
FREQUENCY
DUTY CYCLE
1=50 ±5(%) Typical, 50 ±10(%) Maximum
Characteristic
Specification
ESD Susceptibility
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
Fine Leak Test
MIL-STD-883, Method 1014, Condition A
Flammability
UL94-V0
Gross Leak Test
MIL-STD-883, Method 1014, Condition C
Mechanical Shock
MIL-STD-883, Method 2002, Condition B
Moisture Resistance
MIL-STD-883, Method 1004
Moisture Sensitivity
J-STD-020, MSL 1
Resistance to Soldering Heat
MIL-STD-202, Method 210, Condition K
Resistance to Solvents
MIL-STD-202, Method 215
Solderability
MIL-STD-883, Method 2003
Temperature Cycling
MIL-STD-883, Method 1010, Condition B
Vibration
MIL-STD-883, Method 2007, Condition A
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