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參數(shù)資料
| 型號(hào)： | ES52K1G30N-26.000MTR |
| 廠商： | ECLIPTEK CORP |
| 元件分類： | XO, clock |
| 英文描述： | TCXO, CLIPPED SINE OUTPUT, 26 MHz |
| 封裝： | ROHS COMPLIANT, CERAMIC, SMD, 4 PIN |
| 文件頁(yè)數(shù)： | 5/5頁(yè) |
| 文件大小： | 157K |
| 代理商： | ES52K1G30N-26.000MTR |
T Min
S
T Max
S
Critical Zone
T to T
L
P
Ramp-up
Ramp-down
T
L
T
P
t 25°C to Peak
t Preheat
S
t L
t
P
Temperature
(T)
Time (t)
Recommended Solder Reflow Methods
ES52K1G30N-26.000M TR
Low Temperature Infrared/Convection 240°C
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
N/A
- Temperature Typical (TS TYP)
150°C
- Temperature Maximum (TS MAX)
N/A
- Time (tS MIN)
60 - 120 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
150°C
- Time (tL)
200 Seconds Maximum
Peak Temperature (TP)
240°C Maximum
Target Peak Temperature (TP Target)
240°C Maximum 1 Time / 230°C Maximum 2 Times
Time within 5°C of actual peak (tp)
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
Ramp-down Rate
5°C/second Maximum
Time 25°C to Peak Temperature (t)
N/A
Moisture Sensitivity Level
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 5 of 5
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