參數(shù)資料
型號(hào): EQW010A0B
廠商: LINEAGE POWER LLC
元件分類: 電源模塊
英文描述: 1-OUTPUT DC-DC REG PWR SUPPLY MODULE
封裝: EIGHTH-BRICK PACKAGE-8
文件頁數(shù): 11/28頁
文件大?。?/td> 1127K
代理商: EQW010A0B
Data Sheet
August 29, 2007
EQW010-040 Series Power Modules
36 – 75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current
Tyco Electronics Power Systems
19
Surface Mount Information
Pick and Place
The EQW010-040 modules use an open frame
construction and are designed for a fully automated
assembly process. The modules are fitted with a
label designed to provide a large surface area for pick
and place operations. The label meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
temperatures of up to 300
oC. The label also carries
product information such as product code, serial
number and the location of manufacture.
Figure 64. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.
Tin Lead Soldering
The EQW010-040 power modules are lead free
modules and can be soldered either in a lead-free
solder process or in a conventional Tin/Lead (Sn/Pb)
process. It is recommended that the customer review
data sheets in order to customize the solder reflow
profile for each application board assembly. The
following instructions must be observed when
soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process
peak reflow temperatures are limited to less than
235
oC. Typically, the eutectic solder melts at 183oC,
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
R
E
FLOW
TEMP
(
°C)
0
50
100
150
200
250
300
Preheat zone
max 4oCs-1
Soak zone
30-240s
Heat zone
max 4oCs-1
Peak Temp 235oC
Cooling
zone
1-4oCs-1
T
lim above
205oC
REFLOW TIME (S)
Figure 65. Reflow Profile for Tin/Lead (Sn/Pb)
process
MAX
TEMP
S
O
LD
ER
(
°C)
200
205
210
215
220
225
230
235
240
0
1020
30
4050
60
Figure 66. Time Limit Curve Above 205
oC for
Tin/Lead (Sn/Pb) process
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EQW010A0B1 制造商:LINEAGEPOWER 制造商全稱:LINEAGEPOWER 功能描述:36 - 75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current
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