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參數(shù)資料
| 型號： | EPI330352BH68 |
| 廠商： | PCA Electronics Inc. |
| 英文描述： | Surface Mount Power Inductor |
| 中文描述： | 表面安裝電源電感 |
| 文件頁數(shù)： | 1/1頁 |
| 文件大小： | 32K |
| 代理商： | EPI330352BH68 |
E L E C T R O N I C S I N C .
Surface Mount Power Inductor
TEL: (818) 892-0761
FAX: (818) 894-5791
http://www.pca.com
PCA ELECTRONICS, INC.
16799 SCHOENBORN ST.
NORTH HILLS, CA 91343
Optimized for National’s LM267X & LM259X Series
Low loss material ensures operation in high frequency switching
converters, such as Buck, Boost or as output averaging filter inductor
Also suitable for use in high quality filter applications
150 KHz & 260 KH KHz Switching Frequency
Add “-LF” after part number for Lead-Free
Low Cost Inductor
EPI BH68 & EPI BH68-LF Series
Product performance is limited to specified parameters. Data is subject to change without prior notice.
CSIXXXXXXBH68 & -LF Rev. - 7/2705 FT
Primary Specification
Unless Otherwise Specified Dimensions are in Inches /mm ± .010 /.25
Temp. Rise
@ Vt1
°C (Typ.)
32
---
---
---
31
42
---
37
---
43
---
33
43
39
Vt1
(V-μsec)
150 KHz
12.0
---
---
---
33.4
40.0
---
46.7
---
26.7
---
55.4
56.7
73.4
6.53
27
27
40
38
60
60
87
87
91
91
128
194
265
Inductance
(μH ± 20%)
@ 0 Adc
DCR
(
Typ.)
0.006
0.025
0.025
0.038
0.046
0.074
0.074
0.090
0.090
0.091
0.091
0.110
0.260
0.394
@ Vt2
(mW)
---
290
290
260
---
---
185
---
155
---
60
---
---
---
Idc
(mA)
9700
5000
5000
4000
3500
3500
3500
3000
3000
3500
3500
2500
2000
1500
Part
Number
EPI6L5972BH68
EPI220502BH68
EPI330402BH68
EPI330352BH68
EPI470352BH68
EPI680302BH68
EPI680352BH68
EPI101252BH68
EPI151202BH68
EPI221152BH68
Inductance
(μH ± 15%)
@ Idc
5.16
22
22
33
33
47
47
68
68
68
68
100
150
220
@ Vt1
(mW)
137
---
---
---
210
185
---
155
---
45
---
155
113
134
National
Semicon.
Chip
---
LM267X-L41
LM267X-L50
LM267X-L40
LM259X-L40
LM259X-L39
LM267X-L39
LM259X-L38
LM267X-L38
LM267X-L44
LM259X-L44
LM259X-L37
LM259X-L36
LM259X-L35
---
23.1
23.1
27.0
---
---
28.5
---
30.8
---
12.7
---
---
---
Vt2
(V-μsec)
260 KHz
@ Vt2
°C (Typ.)
---
35
35
34
---
---
42
---
37
---
44
---
---
---
Package BH68
.940
Max.
(23.88)
.940
Max.
(23.88)
.830
(21.08)
.700
(17.18)
.080 (2.03)
CSIXXD.C.
.390 Max.
(9.91)
Pad
Layout
.830
(21.08)
Pin 1
I.D.
*Coil must clear Seating Plane by .010/0.25
Coplanarity : .005/.013
*Seating Plane
Core Loss
Applications
Vin
Vout
LX
μH
D1
8V-40V
Cin
Cout
CB
10nF
FB
Vsw
Gnd
On/Off
LM267X
+
+
+Vin
Regulated
Output
Load
LX
μH
D1
1N5822
Cin
Cout
Feedback
Output
Vsw
On/Off
Gnd
LM259X
+
+
Unregulated
DC Input
Notes :
1. Assembly Process
(Solder Composition)
2. Peak Solder Rating
(per IPC/JEDEC J-STD-020C)
3. Moisture Sensitive Levels (MSL)
(per IPC/JEDEC J-STD-020C)
4. Weight
5. Packaging Information
(Tray)
(Tape & Reel)
(Assembly Solder)
1
(unlimited,
≤
30°C/85%RH)
19.4 grams
EPIXXXXXXBH68-LF
Sn
260°C (+0°C)
48 pieces
pieces/13” reel
(*EPIXXXXXXBH68-LFTR)
EPIXXXXXXBH68
SnPb
225°C (+0/-5°C)
1
(unlimited,
≤
30°C/85%RH)
19.4 grams
48 pieces
pieces/13” reel
(*EPIXXXXXXBH68-TR)
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