參數(shù)資料
型號： EPF6024ABC256-3
廠商： ALTERA CORP
元件分類： PLD
英文描述： LOADABLE PLD, PBGA256
封裝： BGA-256
文件頁數(shù)： 18/57頁
文件大?。?/td> 508K
代理商： EPF6024ABC256-3
Altera Corporation
25
FLEX 6000 Programmable Logic Device Family Data Sheet
Figure 14. IOE Connection to Column Interconnect
SameFrame
Pin-Outs
3.3-V FLEX 6000 devices support the SameFrame pin-out feature for
FineLine BGA packages. The SameFrame pin-out feature is the
arrangement of balls on FineLine BGA packages such that the lower-ball-
count packages form a subset of the higher-ball-count packages.
SameFrame pin-outs provide the flexibility to migrate not only from
device to device within the same package, but also from one package to
another. A given printed circuit board (PCB) layout can support multiple
device density/package combinations. For example, a single board layout
can support an EPF6016A device in a 100-pin FineLine BGA package or an
EPF6024A device in a 256-pin FineLine BGA package.
The Altera software packages provide support to design PCBs with
SameFrame pin-out devices. Devices can be defined for present and future
use. The Altera software packages generate pin-outs describing how to lay
out a board to take advantage of this migration (see Figure 15).
Row Interconnect
Column Interconnect
Each IOE can drive two
column interconnect channels.
Each IOE data and OE signal is
driven to a local interconnect.
Any LE can drive a
pin through the row
and local interconnect.
IOE
LAB
FastFLEX I/O: An
LE can drive a
pin through a local
interconnect for faster
clock-to-output times.
相關(guān)PDF資料
PDF描述
EPF6024ABI256-2 LOADABLE PLD, PBGA256
EPF6024ATC144-1 LOADABLE PLD, PQFP144
EPF6024ATC144-2 LOADABLE PLD, PQFP144
EPF6024ATC144-3 LOADABLE PLD, PQFP144
EPF6024AQC208-1 LOADABLE PLD, PQFP208
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EPF6024ABC256-3N 制造商:Altera Corporation 功能描述:FPGA FLEX 6000 Family 24K Gates 1960 Cells 142.86MHz CMOS Technology 3.3V 256-Pin BGA 制造商:Altera Corporation 功能描述:FPGA FLEX 6000 Family 24K Gates 1960 Cells 142.86MHz 0.42um Technology 3.3V 256-Pin BGA
EPF6024ABI256-2 功能描述:IC FLEX 6000 FPGA 24K 256-BGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:FLEX 6000 產(chǎn)品變化通告:XC4000(E,L) Discontinuation 01/April/2002 標準包裝:24 系列:XC4000E/X LAB/CLB數(shù):100 邏輯元件/單元數(shù):238 RAM 位總計:3200 輸入/輸出數(shù):80 門數(shù):3000 電源電壓:4.5 V ~ 5.5 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:120-BCBGA 供應商設(shè)備封裝:120-CPGA（34.55x34.55）
EPF6024AFC256-1 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 6000 196 LABs 219 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF6024AFC256-2 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 6000 196 LABs 219 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF6024AFC256-2AA 制造商:Rochester Electronics LLC 功能描述:- Bulk
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