參數資料
型號: EPC2TC32N
廠商: Altera
文件頁數: 8/26頁
文件大小: 0K
描述: IC CONFIG DEVICE 1.6MBIT 32-TQFP
產品培訓模塊: Three Reasons to Use FPGA's in Industrial Designs
標準包裝: 250
系列: EPC
可編程類型: 系統內可編程
存儲容量: 1.6Mb
電源電壓: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
工作溫度: 0°C ~ 70°C
封裝/外殼: 32-TQFP
供應商設備封裝: 32-TQFP(7x7)
包裝: 托盤
其它名稱: 544-1377
EPC2TC32N-ND
Page 16
Timing Information
Configuration Devices for SRAM-Based LUT Devices
January 2012
Altera Corporation
Timing Information
Figure 5 shows the timing waveform when using a configuration device.
Table 8 lists the timing parameters when using EPC2 devices at 3.3 V.
Figure 5. Timing Waveform Using a Configuration Device
Note to Figure 5:
(1) The EPC2 device drives DCLK low and DATA high after configuration. The EPC1 and EPC1441 devices drive DCLK low and tri-state DATA after
configuration.
DD
D
0
1
2
3
Dn
Tri-State
User Mode
(1)
tOEZX
tPOR
tCH
tCL
tDSU
tCO
tDH
Tri-State
OE/nSTATUS
nCS/CONF_DONE
DCLK
DATA
User I/O
INIT_DONE
nINIT_CONF or VCC/nCONFIG
Table 8. Timing Parameters when Using EPC2 devices at 3.3 V
Symbol
Parameter
Min
Typ
Max
Units
tPOR
POR delay (1)
——
200
ms
tOEZX
OE
high to DATA output enabled
80
ns
tCE
OE
high to first rising edge on DCLK
——
300
ns
tDSU
Data
setup time before rising edge on DCLK
30
ns
tDH
Data
hold time after rising edge on DCLK
0—
ns
tCO
DCLK
to DATA out
30
ns
tCDOE
DCLK
to DATA enable/disable
30
ns
fCLK
DCLK
frequency
5
7.7
12.5
MHz
tMCH
DCLK
high time for the first device in the configuration chain
40
65
100
ns
tMCL
DCLK
low time for the first device in the configuration chain
40
65
100
ns
tSCH
DCLK
high time for subsequent devices
40
ns
tSCL
DCLK
low time for subsequent devices
40
ns
tCASC
DCLK
rising edge to nCASC
25
ns
tCCA
nCS
to nCASC cascade delay
15
ns
tOEW
OE
low pulse width (reset) to guarantee counter reset
100
ns
tOEC
OE
low (reset) to DCLK disable delay
30
ns
tNRCAS
OE
low (reset) to nCASC delay
30
ns
Note to Table 8:
(1) During initial power-up, a POR delay occurs to permit voltage levels to stabilize. Subsequent reconfigurations do not incur this delay.
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