參數(shù)資料
型號(hào): EP4CE30F29C8L
廠商: Altera
文件頁數(shù): 29/42頁
文件大?。?/td> 0K
描述: IC CYCLONE IV FPGA 30K 780FBGA
產(chǎn)品培訓(xùn)模塊: Three Reasons to Use FPGA's in Industrial Designs
Cyclone IV FPGA Family Overview
特色產(chǎn)品: Cyclone? IV FPGAs
標(biāo)準(zhǔn)包裝: 36
系列: CYCLONE® IV E
LAB/CLB數(shù): 1803
邏輯元件/單元數(shù): 28848
RAM 位總計(jì): 608256
輸入/輸出數(shù): 532
電源電壓: 0.97 V ~ 1.03 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 780-BBGA
供應(yīng)商設(shè)備封裝: 780-FBGA(29x29)
Chapter 1: Cyclone IV Device Datasheet
1–35
Switching Characteristics
December 2013
Altera Corporation
Table 1–42 and Table 1–43 list the IOE programmable delay for Cyclone IV E 1.2 V
core voltage devices.
Table 1–42. IOE Programmable Delay on Column Pins for Cyclone IV E 1.2 V Core Voltage Devices (1), (2)
Parameter
Paths
Affected
Number
of
Setting
Min
Offset
Max Offset
Unit
Fast Corner
Slow Corner
C6
I7
A7
C6
C7
C8
I7
A7
Input delay from pin to
internal cells
Pad to I/O
dataout to
core
7
0
1.314 1.211 1.211 2.177 2.340 2.433 2.388 2.508
ns
Input delay from pin to
input register
Pad to I/O
input register
8
0
1.307 1.203 1.203
2.19
2.387 2.540 2.430 2.545
ns
Delay from output
register to output pin
I/O output
register to
pad
2
0
0.437 0.402 0.402 0.747 0.820 0.880 0.834 0.873
ns
Input delay from
dual-purpose clock pin
to fan-out destinations
Pad to global
clock
network
12
0
0.693 0.665 0.665 1.200 1.379 1.532 1.393 1.441
ns
Notes to Table 1–42:
(1) The incremental values for the settings are generally linear. For the exact values for each setting, use the latest version of the Quartus II software.
(2) The minimum and maximum offset timing numbers are in reference to setting 0 as available in the Quartus II software.
Table 1–43. IOE Programmable Delay on Row Pins for Cyclone IV E 1.2 V Core Voltage Devices (1), (2)
Parameter
Paths
Affected
Number
of
Setting
Min
Offset
Max Offset
Unit
Fast Corner
Slow Corner
C6
I7
A7
C6
C7
C8
I7
A7
Input delay from pin to
internal cells
Pad to I/O
dataout to
core
7
0
1.314 1.209 1.209 2.201 2.386 2.510 2.429 2.548
ns
Input delay from pin to
input register
Pad to I/O
input register
8
0
1.312 1.207 1.207 2.202 2.402 2.558 2.447 2.557
ns
Delay from output
register to output pin
I/O output
register to
pad
2
0
0.458 0.419 0.419 0.783 0.861 0.924 0.875 0.915
ns
Input delay from
dual-purpose clock pin
to fan-out destinations
Pad to global
clock
network
12
0
0.686 0.657 0.657 1.185 1.360 1.506 1.376 1.422
ns
Notes to Table 1–43:
(1) The incremental values for the settings are generally linear. For the exact values for each setting, use the latest version of the Quartus II software.
(2) The minimum and maximum offset timing numbers are in reference to setting 0 as available in the Quartus II software.
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參數(shù)描述
EP4CE30F29C8LN 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Cyclone IV E 1803 LABs 532 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP4CE30F29C8N 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Cyclone IV E 1803 LABs 532 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP4CE30F29C9L 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Cyclone IV E 1803 LABs 532 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP4CE30F29C9LN 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Cyclone IV E 1803 LABs 532 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP4CE30F29I7 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Cyclone IV E 1803 LABs 532 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256