參數(shù)資料
型號(hào)： EL7585A
廠商： Intersil Corporation
英文描述： TFT-LCD Power Supply
中文描述： TFT - LCD的電源供應(yīng)器
文件頁(yè)數(shù)： 16/18頁(yè)
文件大?。?/td> 730K
代理商： EL7585A
16
FN7523.2
September 21, 2005
Over-Temperature Protection
An internal temperature sensor continuously monitors the
die temperature. In the event that the die temperature
exceeds the thermal trip point of 140°C, the device will shut
down.
Layout Recommendation
The device's performance including efficiency, output noise,
transient response and control loop stability is dramatically
affected by the PCB layout. PCB layout is critical, especially
at high switching frequency.
There are some general guidelines for layout:
1. Place the external power components (the input
capacitors, output capacitors, boost inductor and output
diodes, etc.) in close proximity to the device. Traces to
these components should be kept as short and wide as
possible to minimize parasitic inductance and resistance.
2. Place V
REF
and V
DD
bypass capacitors close to the pins.
3. Minimize the length of traces carrying fast signals and
high current.
4. All feedback networks should sense the output voltage
directly from the point of load, and be as far away from LX
node as possible.
5. The power ground (PGND) and signal ground (SGND)
pins should be connected at only one point near the main
decoupling capacitors.
6. The exposed die plate, on the underneath of the
package, should be soldered to an equivalent area of
metal on the PCB. This contact area should have multiple
via connections to the back of the PCB as well as
connections to intermediate PCB layers, if available, to
maximize thermal dissipation away from the IC.
7. To minimize the thermal resistance of the package when
soldered to a multi-layer PCB, the amount of copper track
and ground plane area connected to the exposed die
plate should be maximized and spread out as far as
possible from the IC. The bottom and top PCB areas
especially should be maximized to allow thermal
dissipation to the surrounding air.
8. A signal ground plane, separate from the power ground
plane and connected to the power ground pins only at the
exposed die plate, should be used for ground return
connections for feedback resistor networks (R
1
, R
11
,
R
41
) and the V
REF
capacitor, C
22
, the C
DELAY
capacitor
C
7
and the integrator capacitor C
23
.
9. Minimize feedback input track lengths to avoid switching
noise pick-up.
A two-layer demo board is available to illustrate the proper
layout implementation. A four-layer demo board can be used
to further optimize the layout recommendations.
Demo Board Layout
FIGURE 29. TOP LAYER
FIGURE 30. BOTTOM LAYER
EL7585A
相關(guān)PDF資料
PDF描述
EL7585AILZ TFT-LCD Power Supply
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EL7585AILZ-T7 TFT-LCD Power Supply
EL7585IL-T13 TFT-LCD Power Supply
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EL7585AILZ 功能描述:IC POWER SUPPLY TFT-LCD 20-QFN RoHS:是 類別:集成電路 (IC) >> PMIC - 穩(wěn)壓器 - 專用型 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,000 系列:- 應(yīng)用:電源，ICERA E400，E450 輸入電壓:4.1 V ~ 5.5 V 輸出數(shù):10 輸出電壓:可編程 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:42-WFBGA，WLCSP 供應(yīng)商設(shè)備封裝:42-WLP 包裝:帶卷 (TR)
EL7585AILZ-T13 功能描述:IC POWER SUPPLY TFT-LCD 20-QFN RoHS:是 類別:集成電路 (IC) >> PMIC - 穩(wěn)壓器 - 專用型 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,000 系列:- 應(yīng)用:電源，ICERA E400，E450 輸入電壓:4.1 V ~ 5.5 V 輸出數(shù):10 輸出電壓:可編程 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:42-WFBGA，WLCSP 供應(yīng)商設(shè)備封裝:42-WLP 包裝:帶卷 (TR)
EL7585AILZ-T7 功能描述:IC POWER SUPPLY TFT-LCD 20-QFN RoHS:是 類別:集成電路 (IC) >> PMIC - 穩(wěn)壓器 - 專用型 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,000 系列:- 應(yīng)用:電源，ICERA E400，E450 輸入電壓:4.1 V ~ 5.5 V 輸出數(shù):10 輸出電壓:可編程 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:42-WFBGA，WLCSP 供應(yīng)商設(shè)備封裝:42-WLP 包裝:帶卷 (TR)
EL7585AP_06 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:TFT-LCD Power Supply
EL7585IL 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:TFT-LCD Power Supply
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