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參數(shù)資料
| 型號： | EL7556AC |
| 元件分類： | 開關(guān)穩(wěn)壓 |
| 英文描述： | Adjustable Synchronous DC:DC Switching Regulator |
| 中文描述： | 可調(diào)同步DC-DC開關(guān)穩(wěn)壓器 |
| 文件頁數(shù)： | 4/13頁 |
| 文件大小： | 262K |
| 代理商： | EL7556AC |
12
EL7556AC
Programmable CPU Power Supply Unit
E
L
7556AC
and 100 C respectively. To enable thermal shutdown
this pin should be tied directly to OUTEN. Use of this
feature is recommended during normal operation
Power Good and Power On Reset
During power up the output regulator will be disabled
until VIN reaches a value of approximately 4.0V.
Approximately 500mV of hysteresis is present to elimi-
nate noise induced oscillations.
Under-voltage and over-voltage conditions on the regu-
lator output are detected through an internal window
comparator. A logic 1 on the PWRGD output indicates
that regulated output voltage is within ±10% of the nom-
inally programmed output voltage. Although small, the
typical values of the PWRGD threshold will vary with
changes to external feedback (and resultant loop gain) of
the system. This dependence is shown in the typical per-
formance curves.
Thermal Management
The EL7556AC utilizes fused-lead packaging technol-
ogy in conjunction with the system board layout to
achieve a lower thermal resistance than typically found
in standard 28 lead SOIC packages. By fusing multiple
leads to the die substrate thermal energy flows through a
thermally conductive path (metal) instead of thermally
resistive plastic. After conducting heat from the die to
the leads, heat transfer occurs by convection. If a suffi-
cient amount of metal area is connected to the package
leads a junction-to-ambient resistance of 31C/W can be
achieved compared to 100 C/W found in standard pack-
ages. The general relationship between board area and
thermal resistance for this package is shown in the per-
formance curves. It can be readily seen that the thermal
resistance approaches an asymptotic value of approxi-
mately 31C/W. Additional information can be found in
Application Note #8 (Measuring the Thermal Resistance
of Power Surface-Mount Packages), and Application
Note #13 (EL75XX Thermal Design Considerations).
If the thermal shutdown pin is connected to OUTEN the
IC will enter thermal shutdown when the maximum
junction temperature is reached. For a thermal shutdown
of 135C and power dissipation of 2.2W the ambient
temperature is limited to a maximum value of 67C (typ-
ical). The ambient temperature range can be extended
with the application of air flow. For example, the addi-
tion of 100LFM reduces the thermal resistance by
approximately 15% and can extend the operating ambi-
ent to 77C (typical). Since the thermal performance of
the IC is heavily dependent on the board layout, the sys-
tem designer should exercise care during the design
phase to ensure that the IC will operate under the worst-
case environmental conditions.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| EL7556ACM | 制造商:ELAN 功能描述: |
| EL7556B | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Integrated Adjustable 6 Amp Synchronous Switcher |
| EL7556BC | 制造商:ELANTEC 制造商全稱:ELANTEC 功能描述:Integrated Adjustable 6 Amp Synchronous Switcher |
| EL7556BCM | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Integrated Adjustable 6 Amp Synchronous Switcher |
| EL7556BCM-T13 | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Integrated Adjustable 6 Amp Synchronous Switcher |
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