All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certificati" />
參數(shù)資料
型號: EL5611IRE-T13
廠商: Intersil
文件頁數(shù): 4/12頁
文件大?。?/td> 0K
描述: IC AMP 6-CHAN R-R 60MHZ 24HTSSOP
標準包裝: 2,500
放大器類型: 通用
電路數(shù): 6
輸出類型: 滿擺幅
轉換速率: 75 V/µs
增益帶寬積: 32MHz
-3db帶寬: 60MHz
電流 - 輸入偏壓: 2nA
電壓 - 輸入偏移: 3000µV
電流 - 電源: 2.5mA
電流 - 輸出 / 通道: 65mA
電壓 - 電源,單路/雙路(±): 4.5 V ~ 16.5 V,±2.25 V ~ 8.25 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 24-TSSOP(0.173",4.40mm)裸露焊盤
供應商設備封裝: 24-HTSSOP
包裝: 帶卷 (TR)
12
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN7355.1
August 3, 2005
when sourcing, and:
when sinking,
where:
i = 1 to 6 for EL5611 and 1 to 8 for EL5811
VS = Total supply voltage
ISMAX = Maximum supply current per amplifier
VOUTi = Maximum output voltage of the application
ILOADi = Load current
If we set the two PDMAX equations equal to each other, we
can solve for RLOADi to avoid device overheat. Figures 29
and 30 provide a convenient way to see if the device will
overheat. The maximum safe power dissipation can be
found graphically, based on the package type and the
ambient temperature. By using the previous equation, it is a
simple matter to see if PDMAX exceeds the device's power
derating curves. To ensure proper operation, it is important
to observe the recommended derating curves shown in
Figures 29 & 30.
Unused Amplifiers
It is recommended that any unused amplifiers in a dual and
a quad package be configured as a unity gain follower. The
inverting input should be directly connected to the output
and the non-inverting input tied to the ground plane.
Power Supply Bypassing and Printed Circuit
Board Layout
The EL5611 and EL5811 can provide gain at high frequency.
As with any high-frequency device, good printed circuit
board layout is necessary for optimum performance. Ground
plane construction is highly recommended, lead lengths
should be as short as possible and the power supply pins
must be well bypassed to reduce the risk of oscillation. For
normal single supply operation, where the VS- pin is
connected to ground, a 0.1F ceramic capacitor should be
placed from VS+ to pin to VS- pin. A 4.7F tantalum
capacitor should then be connected in parallel, placed in the
region of the amplifier. One 4.7F capacitor may be used for
multiple devices. This same capacitor combination should be
placed at each supply pin to ground if split supplies are to be
used.
PDMAX
ΣiV
[
S
ISMAX V
(
OUTiVS- )
ILOADi
×
+
×]
=
FIGURE 29. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD - HTSSOP
EXPOSED DIEPAD SOLDERED TO PCB PER
JESD51-5
3.5
3
2.5
1.5
1
0.5
0
255075
100
150
AMBIENT TEMPERATURE (°C)
P
O
WER
DIS
S
IPATION
(W
)
3.030W
θJA=33°C/W
HTSSOP24
θJA=30°C/W
HTSSOP28
125
85
2
3.333W
FIGURE 30. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1
0.9
0.6
0.4
0.3
0.2
0.1
0
255075
100
150
AMBIENT TEMPERATURE (°C)
POWE
R
DI
SSI
PATI
ON
(
W
)
85
0.8
0.5
0.7
125
833mW
θJA=120°C/W
HTSSOP24
θJA=110°C/W
HTSSOP28
909mW
EL5611, EL5811
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