參數(shù)資料
型號: EL5421CY
英文描述: Quad 12MHz Rail-to-Rail Input-Output Buffer
中文描述: 四12MHz的軌到軌輸入,輸出緩沖器
文件頁數(shù): 3/13頁
文件大小: 255K
代理商: EL5421CY
11
EL5421C
Quad 12MHz Rail-to-Rail Input-Output Buffer
EL
5421C
maximum junction temperature for the application to
determine if load conditions need to be modified for the
buffer to remain in the safe operating area.
The maximum power dissipation allowed in a package is
determined according to:
where:
TJMAX = Maximum Junction Temperature
TAMAX= Maximum Ambient Temperature
θJA = Thermal Resistance of the Package
PDMAX = Maximum Power Dissipation in the
Package
The maximum power dissipation actually produced by
an IC is the total quiescent supply current times the total
power supply voltage, plus the power in the IC due to the
loads, or:
when sourcing, and:
when sinking.
Where:
i = 1 to 4 for Quad
VS = Total Supply Voltage
ISMAX = Maximum Supply Current Per Channel
VOUTi = Maximum Output Voltage of the
Application
ILOADi = Load current
If we set the two PDMAX equations equal to each other,
we can solve for RLOADi to avoid device overheat. Fig-
ure 3 and Figure 4 provide a convenient way to see if the
device will overheat. The maximum safe power dissipa-
tion can be found graphically, based on the package type
and the ambient temperature. By using the previous
equation, it is a simple matter to see if PDMAX exceeds
the device’s power derating curves. To ensure proper
operation, it is important to observe the recommended
derating curves shown in Figure 3 and Figure 4.
Figure 3. Package Power Dissipation vs
Ambient Temperature
Figure 4. Package Power Dissipation vs
Ambient Temperature
Unused Buffers
It is recommended that any unused buffer have the input
tied to the ground plane.
P
DM AX
T
JMAX
T
AM AX
Θ
JA
----------------------------------------------
=
P
DMAX
ΣiV
[
S
I
SMA X
V
(
S +VOUT i )
I
L OAD i
×
+
×]
=
P
DMA X
ΣiV
[
S
I
SM AX
V
(
OU T iVS - )
I
L OAD i
×
+
×]
=
MSOP10 Package Mounted on JEDEC JESD51-7
High Effective Thermal Conductivity Test Board
50
150
400
800
P
ow
er
Di
ss
ipat
ion
(m
W)
Ambient Temperature (°C)
0
100
0125
1200
MAX TJ=125°C
25
75
1000
600
200
MS
OP1
0---
- Θ
JA =1
15°
C/W
870mW
85
MSOP10 Package Mounted on JEDEC JESD51-3
Low Effective Thermal Conductivity Test Board
P
ower
D
is
si
pat
io
n(
m
W)
Ambient Temperature (°C)
50
150
100
0125
25
75 85
600
500
400
300
200
100
0
485mW
MAX TJ=125°C
MS
OP
10-
--Θ
JA =2
06°
C/W
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