參數(shù)資料
型號: EL5157IW-T7
廠商: INTERSIL CORP
元件分類: 音頻/視頻放大
英文描述: Global Limit Switches Series GLS: Side Rotary With Roller - Adjustable, 1NC 1NO SPDT Snap Action, PF1/2
中文描述: 1 CHANNEL, VIDEO AMPLIFIER, PDSO5
封裝: PLASTIC, MO-178AA, SOT-23, 5 PIN
文件頁數(shù): 12/12頁
文件大小: 350K
代理商: EL5157IW-T7
12
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
The maximum power dissipation allowed in a package is
determined according to:
Where:
T
JMAX
= Maximum junction temperature
T
AMAX
= Maximum ambient temperature
θ
JA
= Thermal resistance of the package
The maximum power dissipation actually produced by an IC
is the total quiescent supply current times the total power
supply voltage, plus the power in the IC due to the load, or:
For sourcing:
For sinking:
Where:
V
S
= Supply voltage
IS
MAX
= Maximum quiescent supply current
V
OUT
= Maximum output voltage of the application
R
LOAD
= Load resistance tied to ground
I
LOAD
= Load current
N = number of amplifiers (Max = 2)
By setting the two PD
MAX
equations equal to each other, we
can solve the output current and R
LOAD
to avoid the device
overheat.
Power Supply Bypassing and Printed Circuit
Board Layout
As with any high frequency device, a good printed circuit
board layout is necessary for optimum performance. Lead
lengths should be as sort as possible. The power supply pin
must be well bypassed to reduce the risk of oscillation. For
normal single supply operation, where the V
S
- pin is
connected to the ground plane, a single 4.7μF tantalum
capacitor in parallel with a 0.1μF ceramic capacitor from V
S
+
to GND will suffice. This same capacitor combination should
be placed at each supply pin to ground if split supplies are to
be used. In this case, the V
S
- pin becomes the negative
supply rail.
For good AC performance, parasitic capacitance should be
kept to minimum. Use of wire wound resistors should be
avoided because of their additional series inductance. Use
of sockets should also be avoided if possible. Sockets add
parasitic inductance and capacitance that can result in
compromised performance. Minimizing parasitic capacitance
at the amplifier's inverting input pin is very important. The
feedback resistor should be placed very close to the
inverting input pin. Strip line design techniques are
recommended for the signal traces.
PD
MAX
T
--------------------------------------------
T
JA
=
PD
MAX
V
S
I
SMAX
V
S
V
OUTi
(
)
i
1
=
n
V
Li
-----------------
×
+
×
=
PD
MAX
V
S
I
SMAX
V
OUTi
V
S
(
)
i
1
=
n
I
LOADi
×
+
×
=
EL5156, EL5157, EL5256, EL5257
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