參數(shù)資料
型號(hào): EL5129IRZ-T13
廠商: INTERSIL CORP
元件分類(lèi): 緩沖放大器
英文描述: Multi-Channel Buffers
中文描述: HEX BUFFER AMPLIFIER, PDSO20
封裝: MO-153, TSSOP-20
文件頁(yè)數(shù): 11/13頁(yè)
文件大?。?/td> 848K
代理商: EL5129IRZ-T13
11
FN7430.1
May 13, 2005
Power Supply Bypassing and Printed Circuit
Board Layout
As with any high frequency device, good printed circuit
board layout is necessary for optimum performance. Ground
plane construction is highly recommended, lead lengths
should be as short as possible, and the power supply pins
must be well bypassed to reduce the risk of oscillation. For
normal single supply operation, where the V
S
- pin is
connected to ground, one 0.1μF ceramic capacitor should be
placed from the V
S
+ pin to ground. A 4.7μF tantalum
capacitor should then be connected from the V
S
+ pin to
ground. One 4.7μF capacitor may be used for multiple
devices. This same capacitor combination should be placed
at each supply pin to ground if split supplies are to be used.
Important Note: The metal plane used for heat sinking of
the device is electrically connected to the negative
supply potential (V
S
-). If V
S
- is tied to ground, the
thermal pad can be connected to ground. Otherwise, the
thermal pad must be isolated from any other power
planes.
EL5129, EL5329
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PDF描述
EL5329IRZ-T13 Multi-Channel Buffers
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EL5329IRZ-T7 Multi-Channel Buffers
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EL5129 Multi-Channel Buffers
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