FIGURE 38. IS" />
參數(shù)資料
型號(hào): EL1508CSZ-T13
廠商: Intersil
文件頁數(shù): 4/18頁
文件大?。?/td> 0K
描述: IC LINE DRIVER ADSL 16-SOIC
標(biāo)準(zhǔn)包裝: 2,500
類型: 驅(qū)動(dòng)器
驅(qū)動(dòng)器/接收器數(shù): 1/0
電源電壓: 5 V ~ 12 V
安裝類型: 表面貼裝
封裝/外殼: 16-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 16-SOIC
包裝: 帶卷 (TR)
12
FN7014.5
March 26, 2007
FIGURE 37. LOAD RESISTANCE vs OUTPUT VOLTAGE
(ALL POWER MODES)
FIGURE 38. IS+ vs RADJ (FULL POWER MODE)
FIGURE 39. SUPPLY CURRENT vs SUPPLY VOLTAGE
FIGURE 40. POWER DISSIPATION vs AMBIENT
TEMPERATURE for VARIOUS MOUNTED
θ
JAs
(See Thermal Resistance Curve on page 15)
FIGURE 41. 16 LD SOIC POWER DISSIPATION and THERMAL
RESISTANCE
FIGURE 42. 24 LD QFN POWER DISSIPATION vs AMBIENT
TEMPERATURE
Typical Performance Curves (Continued)
21.6
21.4
21.2
21.0
20.8
20.6
50
90
130
150
170
190
DIFFERENTIAL LOAD RESISTANCE (
Ω)
OUT
P
UT
VOLT
AGE
P-P
(V)
70
110
FREQ=100kHz
VS=±12V
RSET=0
AV=10
25
21
17
13
9
5
02468
10
RADJ (kΩ)
I S
+
(mA)
VS=±12V
RFB=10
AV=10
RL=100Ω
30
25
20
15
10
5
0
02
68
10
12
SUPPLY VOLTAGE (V)
SUPPLY
CURRENT
(
m
A)
FULL P
OWER
+
1/3 POWER
2/3 POW
ER
-
+
-
+
-
4
0100
0.5
P
O
WER
DIS
S
IPATION
(W
)
AMBIENT TEMPERATURE (°C)
0
40
4.5
-40
20
-20
60
80
3.5
3.0
2.5
2.0
1.5
1.0
4.0
θJA = 30°C/W
θJA = 43°C/W
θJA = 53°C/W
θJA = 80°C/W
100
-40
-20
0
20
40
60
AMBIENT TEMPERATURE (°C)
POWE
R
DI
SSI
PATI
ON
(W
)
4
0
1
2
2.5
3
3.5
0.5
1.5
80
θ
JA =4
7°C
/W
USING ELANTEC EL1503CS DEMO BOARD, 2”X2”
(4-LAYER). DEMO BOARD WITH HEATSINK VIA
INTERNAL GROUND PLANE
150
0
255075
100
125
AMBIENT TEMPERATURE (°C)
POWE
R
DI
SSI
PATI
ON
(
W
)
4.0
0
0.5
1.0
1.5
2.0
3.0
85
3.5
2.5
θ
JA =
37°
C/W
USING JEDEC JESD51-3 HIGH EFFECTIVE THERMAL
CONDUCTIVITY. (4-LAYER) TEST BOARD, QFN
EXPOSED DIEPAD SOLDERED TO PCB PER JESD51-5
3.378W
EL1508
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