FIGURE 35. IS vs ISET
參數(shù)資料
型號: EL1503ACMZ
廠商: Intersil
文件頁數(shù): 2/17頁
文件大?。?/td> 0K
描述: IC INTERFACE ADSL/HDSL2 20-SOIC
標(biāo)準(zhǔn)包裝: 38
類型: 驅(qū)動器
驅(qū)動器/接收器數(shù): 2/0
規(guī)程: DSL
電源電壓: 5 V ~ 12 V
安裝類型: 表面貼裝
封裝/外殼: 20-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 20-SO
包裝: 管件
10
FN7039.2
March 26, 2007
FIGURE 35. IS vs ISET
FIGURE 36. IS vs ISET
FIGURE 37. POWER DISSIPATION vs AMBIENT
TEMPERATURE for VARIOUS MOUNTED
θJAs
FIGURE 38. POWER DISSIPATION vs AMBIENT
TEMPERATURE
Typical Performance Curves (Continued)
10
±I
S
(mA)
ISET (A)
0
25
100
500
0
300
20
5
200
400
15
I S-
(FU
LL
PO
WE
R)
IS+
(2/3
POW
ER)
IS-
(2/3
POW
ER)
IS+ (
TERM
INAT
E)
IS- (T
ERM
INAT
E)
I S+
(FU
LL
PO
WE
R)
VS = ±12V
10
±I
S
(mA)
ISET (A)
0
25
100
500
0
300
20
5
200
400
15
IS-
(FU
LL
PO
WE
R)
IS+
(2/3
POW
ER)
IS- (
2/3 P
OWE
R)
IS+ (T
ERMIN
ATE)
IS- (T
ERMIN
ATE)
IS+
(FU
LL
PO
WE
R)
VS = ±12V
0
100
0.5
POWE
R
DI
SSI
PATI
ON
(W
)
AMBIENT TEMPERATURE (°C)
0
40
4.5
-40
20
-20
60
80
3.5
3.0
2.5
2.0
1.5
1.0
4.0
θJA = 30°C/W
θJA = 43°C/W
θJA = 53°C/W
θ
JA = 80°C/W
150
0
25
50
75
100
125
AMBIENT TEMPERATURE (°C)
POWER
DISS
IP
AT
ION
(W)
3.0
0
0.5
1.0
1.5
2.0
2.5
85
2.703W
θ
JA =
37
°C
/W
QF
N2
4
POWER DISSIPATION & THERMAL RESISTANCE USING
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY (4-LAYER) TEST BOARD, QFN EXPOSED
DIEPAD SOLDERED TO PCB PER JESD51-5
EL1503A
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