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參數(shù)資料
| 型號： | EK62 |
| 廠商： | Apex Microtechnology Corporation |
| 英文描述： | EVALUATION KIT FOR SA305EX 3 PHASE BLDC MOTORDROVER |
| 中文描述： | 評估板3相無刷直流電機MOTORDROVER的SA305EX |
| 文件頁數(shù)： | 1/2頁 |
| 文件大?。?/td> | 279K |
| 代理商： | EK62 |
APEX MICROTECHNOLOGY CORPORATION TELEPHONE (520) 690-8600 FAX (520) 888-3329 ORDERS (520) 690-8601 EMAIL prodlit@apexmicrotech.com
1
INTRODUCTION
The EK62 evaluation kit is designed to provide a convenient
way to breadboard design ideas for the SA305EX three BLDC
motor driver IC. The PB119 evaluation board is pre-wired for
all required and recommended external components including
the ones for power supply bypassing and current sensing. The
PB119 also includes a breadboard area for constructing your
application circuit.
PARTS LIST
Ref
N/A
N/A
Many
C1, C4 OX7R105KWN
C2, C5 140-ESRL100V100 100μF cap,
N/A
TW12
N/A
91920A865
ApexP/N
HS14
029372326215 SIP Socket
PB119
571-0100
Description/Vendor
Heat Sink
Qty
1
1
Loranger
PC board
Banana Jack
Deltron
1 μF cap
Novacap 1825B105K201N
1
22
2
2
Xicon
Thermal Washer, Apex 1 Box
Standoffs
McMaster-Carr
4
RecommendedComponents(includedinEKkit)
D1-D6 SB5100-T
Diode, 100V, 5A
6
SCHEMATIC
)551 888 "1&9.*$305&$) $0.
"1&9
M I C R O T E C H N O L O G Y
&7"-6"5*0/,*5'034"&91)"4&#-%$.0503%3*7&3
EK62
ASSEMBLY
1. Solder surface mount ceramic capacitors C1 and C4 on the
component side of the board.
2. Solder the SIP socket into the board. Insert the IC fully into
the socket, noting the pin 1 location on the IC and the circuit
board.
3. Add 3 resistors for current sense. Refer to SA305U data-
sheet for acceptable values and power dissipation ratings
of current sense resistors.
4. Install the banana jacks for signals and power. Please note
that the banana jacks need to be installed on both sides of
the board as shown in figure (only for low voltage signals
and Vdd on the bottom end of the board).
5. Mount the electrolytic capacitors C2 and C5 in the specified
location in the board.
6. Solder the diodes D1-D6 provided with the kit for high cur-
rent applications.
7. Mount the standoffs in the four holes provided in the
board.
8. If a heat sink is used, position the thermal washer behind
the package tab of the IC in such a way that the hole on
the washer coincides with the hole on the tab and the heat
sink. Attach the IC to the heat sink in such a way that the
pins hang out of the heat sink. In the PC board remove the
two standoffs on the top of the board. Carefully insert the
part with the heat sink into the socket.
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