參數(shù)資料
型號: EGP10C
廠商: GE Security, Inc.
英文描述: GLASS PASSIVATED FAST EFFICIENT RECTIFIER
中文描述: 玻璃鈍化快速高效整流
文件頁數(shù): 1/2頁
文件大?。?/td> 71K
代理商: EGP10C
EGP10A THRU EGP10G
GLASS PASSIVATED FAST EFFICIENT RECTIFIER
Reverse Voltage -
50 to 400 Volts
Forward Current -
1.0 Ampere
FEATURES
Plastic package has Underwriters Laboratories
Flammability Classification 94V-0
Glass passivated cavity-free junction
Superfast recovery time for high efficiency
Low forward voltage, high current capability
Low leakage current
High surge current capability
High temperature metallurgically
bonded construction
High temperature soldering guaranteed:
300°C/10 seconds, 0.375" (9.5mm) lead length,
5 lbs. (2.3kg) tension
MECHANICAL DATA
Case:
JEDEC DO-204AL molded plastic over glass body
Terminals:
Plated axial leads, solderable per MIL-STD-750,
Method 2026
Polarity:
Color band denotes cathode end
Mounting Position:
Any
Weight:
0.012 ounce, 0.3 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
EGP
10A
EGP
10B
EGP
10C
EGP
10D
EGP
10F
EGP
10G
SYMBOLS
UNITS
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
0.375" (9.5mm) lead length at T
A
=55°C
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load
Maximum instantaneous forward voltage at 1.0A
Maximum DC reverse current
at rated DC blocking voltage
Maximum reverse recovery time
(NOTE 1)
Typical junction capacitance
(NOTE 2)
Typical thermal resistance
(NOTE 3
)
Operating junction and storage temperature range
V
RRM
V
RMS
V
DC
50
35
50
100
70
100
150
105
150
200
140
200
300
210
300
400
280
400
Volts
Volts
Volts
I
(AV)
1.0
Amp
I
FSM
30.0
Amps
V
F
0.95
1.25
Volts
T
A
=25°C
T
A
=125°C
5.0
100
50.0
I
R
μ
A
t
rr
C
J
R
Θ
JA
T
J
, T
STG
ns
pF
22.0
15.0
50.0
°C/W
°C
-65 to +150
NOTES:
(1) Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
(2) Measured at 1.0 MH
Z
and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead length, P.C.B. mounted
4/98
Dimensions in inches and (millimeters)
*
Glass Encapsulation technique is covered by
Patent No. 3,996,602, brazed-lead assembly to Patent No. 3,930,306
DO-204AL
0.107 (2.7)
0.080 (2.0)
DIA.
0.034 (0.86)
0.028 (0.71)
DIA.
1.0 (25.4)
MIN.
1.0 (25.4)
MIN.
0.205 (5.2)
0.160 (4.1)
PATENTED*
相關(guān)PDF資料
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EGP20F Glass Passivated Fast Efficient Rectifier(鈍化玻璃快速效應(yīng)整流器)
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