參數(shù)資料
型號(hào)： EFM32LG232F256
廠商： Energy Micro
文件頁(yè)數(shù)： 58/65頁(yè)
文件大小： 0K
描述： IC MCU 32BIT 256KB FLASH BGA112
標(biāo)準(zhǔn)包裝： 1,000
系列： Leopard Gecko
核心處理器： ARM? Cortex?-M4
芯體尺寸： 32-位
速度： 48MHz
連通性： I²C，IrDA，智能卡，SPI，UART/USART
外圍設(shè)備： 欠壓檢測(cè)/復(fù)位，DMA，POR，PWM，WDT
輸入/輸出數(shù)： 53
程序存儲(chǔ)器容量： 256KB（256K x 8）
程序存儲(chǔ)器類(lèi)型： 閃存
RAM 容量： 32K x 8
電壓 - 電源 (Vcc/Vdd)： 1.85 V ~ 3.8 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 8x12b，D/A 2x12b
振蕩器型： 外部
工作溫度： -40°C ~ 85°C
封裝/外殼： 64-TQFP
包裝： 帶卷 (TR)
Preliminary
...the world's most energy friendly microcontrollers
2013-06-28 - EFM32LG232FXX - d0106_Rev1.10
61
www.energymicro.com
Table of Contents
1. Ordering Information .................................................................................................................................. 2
2. System Summary ...................................................................................................................................... 3
2.1. System Introduction ......................................................................................................................... 3
2.2. Configuration Summary .................................................................................................................... 7
2.3. Memory Map ................................................................................................................................. 8
3. Electrical Characteristics ............................................................................................................................. 9
3.1. Test Conditions .............................................................................................................................. 9
3.2. Absolute Maximum Ratings .............................................................................................................. 9
3.3. General Operating Conditions ........................................................................................................... 9
3.4. Current Consumption ..................................................................................................................... 11
3.5. Transition between Energy Modes .................................................................................................... 12
3.6. Power Management ....................................................................................................................... 12
3.7. Flash .......................................................................................................................................... 13
3.8. General Purpose Input Output ......................................................................................................... 14
3.9. Oscillators .................................................................................................................................... 21
3.10. Analog Digital Converter (ADC) ...................................................................................................... 25
3.11. Digital Analog Converter (DAC) ...................................................................................................... 35
3.12. Operational Amplifier (OPAMP) ...................................................................................................... 36
3.13. Analog Comparator (ACMP) .......................................................................................................... 40
3.14. Voltage Comparator (VCMP) ......................................................................................................... 42
3.15. Digital Peripherals ....................................................................................................................... 42
4. Pinout and Package ................................................................................................................................. 44
4.1. Pinout ......................................................................................................................................... 44
4.2. Alternate functionality pinout ............................................................................................................ 47
4.3. GPIO pinout overview .................................................................................................................... 51
4.4. Opamp pinout overview .................................................................................................................. 51
4.5. TQFP64 Package .......................................................................................................................... 52
5. PCB Layout and Soldering ........................................................................................................................ 54
5.1. Recommended PCB Layout ............................................................................................................ 54
5.2. Soldering Information ..................................................................................................................... 56
6. Chip Marking, Revision and Errata .............................................................................................................. 57
6.1. Chip Marking ................................................................................................................................ 57
6.2. Revision ...................................................................................................................................... 57
6.3. Errata ......................................................................................................................................... 57
7. Revision History ...................................................................................................................................... 58
7.1. Revision 1.10 ............................................................................................................................... 58
7.2. Revision 1.00 ............................................................................................................................... 58
7.3. Revision 0.92 ............................................................................................................................... 58
7.4. Revision 0.90 ............................................................................................................................... 58
A. Disclaimer and Trademarks ....................................................................................................................... 59
A.1. Disclaimer ................................................................................................................................... 59
A.2. Trademark Information ................................................................................................................... 59
B. Contact Information ................................................................................................................................. 60
B.1. Energy Micro Corporate Headquarters .............................................................................................. 60
B.2. Global Contacts ............................................................................................................................ 60
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