參數(shù)資料
型號: EFM32GG880F1024
廠商: Energy Micro
文件頁數(shù): 68/73頁
文件大?。?/td> 0K
描述: IC MCU 32BIT 1024KB FLSH LQFP100
標準包裝: 1,000
系列: Giant Gecko
核心處理器: ARM? Cortex?-M3
芯體尺寸: 32-位
速度: 48MHz
連通性: EBI/EMI,I²C,IrDA,智能卡,SPI,UART/USART
外圍設備: 欠壓檢測/復位,DMA,LCD,POR,PWM,WDT
輸入/輸出數(shù): 86
程序存儲器容量: 1MB(1M x 8)
程序存儲器類型: 閃存
RAM 容量: 128K x 8
電壓 - 電源 (Vcc/Vdd): 1.85 V ~ 3.8 V
數(shù)據(jù)轉換器: A/D 8x12b,D/A 2x12b
振蕩器型: 外部
工作溫度: -40°C ~ 85°C
封裝/外殼: 100-LQFP
包裝: 帶卷 (TR)
Preliminary
...the world's most energy friendly microcontrollers
2013-06-28 - EFM32GG880FXX - d0042_Rev1.10
70
www.energymicro.com
List of Figures
2.1. Block Diagram ....................................................................................................................................... 3
2.2. EFM32GG880 Memory Map with largest RAM and Flash sizes ........................................................................ 9
3.1. Typical Low-Level Output Current, 2V Supply Voltage .................................................................................. 16
3.2. Typical High-Level Output Current, 2V Supply Voltage ................................................................................. 17
3.3. Typical Low-Level Output Current, 3V Supply Voltage .................................................................................. 18
3.4. Typical High-Level Output Current, 3V Supply Voltage ................................................................................. 19
3.5. Typical Low-Level Output Current, 3.8V Supply Voltage ............................................................................... 20
3.6. Typical High-Level Output Current, 3.8V Supply Voltage ............................................................................... 21
3.7. Calibrated LFRCO Frequency vs Temperature and Supply Voltage ................................................................ 23
3.12. Integral Non-Linearity (INL) ................................................................................................................... 30
3.13. Differential Non-Linearity (DNL) .............................................................................................................. 31
3.14. ADC Frequency Spectrum, Vdd = 3V, Temp = 25° ................................................................................... 32
3.15. ADC Integral Linearity Error vs Code, Vdd = 3V, Temp = 25° ..................................................................... 33
3.16. ADC Differential Linearity Error vs Code, Vdd = 3V, Temp = 25° ................................................................. 34
3.17. ADC Absolute Offset, Common Mode = Vdd /2 ........................................................................................ 35
3.19. ADC Temperature sensor readout ......................................................................................................... 36
3.20. OPAMP Common Mode Rejection Ratio ................................................................................................. 39
3.21. OPAMP Positive Power Supply Rejection Ratio ........................................................................................ 39
3.22. OPAMP Negative Power Supply Rejection Ratio ...................................................................................... 40
3.23. OPAMP Voltage Noise Spectral Density (Unity Gain) Vout=1V ..................................................................... 40
3.24. OPAMP Voltage Noise Spectral Density (Non-Unity Gain) .......................................................................... 40
3.25. Typical ACMP Characteristics ............................................................................................................... 42
4.1. EFM32GG880 Pinout (top view, not to scale) ............................................................................................. 46
4.2. Opamp Pinout ...................................................................................................................................... 58
4.3. LQFP100 ............................................................................................................................................. 59
5.1. LQFP100 PCB Land Pattern ................................................................................................................... 61
5.2. LQFP100 PCB Solder Mask .................................................................................................................... 62
5.3. LQFP100 PCB Stencil Design ................................................................................................................. 63
6.1. Example Chip Marking ........................................................................................................................... 64
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