參數(shù)資料
型號: EFM32GG230F1024
廠商: Energy Micro
文件頁數(shù): 61/66頁
文件大?。?/td> 0K
描述: IC MCU 32BIT 1024KB FLASH 64QFN
標(biāo)準(zhǔn)包裝: 1
系列: Giant Gecko
核心處理器: ARM? Cortex?-M3
芯體尺寸: 32-位
速度: 48MHz
連通性: I²C,IrDA,智能卡,SPI,UART/USART
外圍設(shè)備: 欠壓檢測/復(fù)位,DMA,POR,PWM,WDT
輸入/輸出數(shù): 56
程序存儲器容量: 1MB(1M x 8)
程序存儲器類型: 閃存
RAM 容量: 128K x 8
電壓 - 電源 (Vcc/Vdd): 1.85 V ~ 3.8 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 8x12b,D/A 2x12b
振蕩器型: 外部
工作溫度: -40°C ~ 85°C
封裝/外殼: 64-VFQFN 裸露焊盤
包裝: 標(biāo)準(zhǔn)包裝
其它名稱: 914-1043-6
Preliminary
...the world's most energy friendly microcontrollers
2013-06-28 - EFM32GG230FXX - d0035_Rev1.10
64
www.energymicro.com
List of Tables
1.1. Ordering Information ................................................................................................................................ 2
2.1. Configuration Summary ............................................................................................................................ 7
3.1. Absolute Maximum Ratings ...................................................................................................................... 9
3.2. General Operating Conditions ................................................................................................................... 9
3.3. Environmental ....................................................................................................................................... 10
3.4. Current Consumption ............................................................................................................................. 11
3.5. Energy Modes Transitions ...................................................................................................................... 12
3.6. Power Management ............................................................................................................................... 12
3.7. Flash .................................................................................................................................................. 13
3.8. GPIO .................................................................................................................................................. 14
3.9. LFXO .................................................................................................................................................. 21
3.10. HFXO ................................................................................................................................................ 21
3.11. LFRCO .............................................................................................................................................. 22
3.12. HFRCO ............................................................................................................................................. 23
3.13. ULFRCO ............................................................................................................................................ 25
3.14. ADC .................................................................................................................................................. 25
3.15. DAC .................................................................................................................................................. 35
3.16. OPAMP ............................................................................................................................................. 36
3.17. ACMP ............................................................................................................................................... 40
3.18. VCMP ............................................................................................................................................... 42
3.19. Digital Peripherals ............................................................................................................................... 42
4.1. Device Pinout ....................................................................................................................................... 44
4.2. Alternate functionality overview ................................................................................................................ 47
4.3. GPIO Pinout ........................................................................................................................................ 51
4.4. QFN64 (Dimensions in mm) .................................................................................................................... 53
5.1. QFN64 PCB Land Pattern Dimensions (Dimensions in mm) .......................................................................... 54
5.2. QFN64 PCB Solder Mask Dimensions (Dimensions in mm) ........................................................................... 55
5.3. QFN64 PCB Stencil Design Dimensions (Dimensions in mm) ........................................................................ 56
相關(guān)PDF資料
PDF描述
VJ2225A153JBAAT4X CAP CER 0.015UF 50V 5% NP0 2225
VE-B6W-CU-B1 CONVERTER MOD DC/DC 5.5V 200W
C8051F005-GQR IC 8051 MCU 32K FLASH 64TQFP TAP
EFM32LG940F256 IC MCU 32BIT 256KB FLASH 64QFN
MCHC908JK3CPE IC MCU 4K FLASH 20-PDIP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EFM32GG230F1024G-E-QFN64R 功能描述:IC MCU 32BIT 1MB FLASH 64QFN 制造商:silicon labs 系列:Giant Gecko 包裝:剪切帶(CT) 零件狀態(tài):在售 核心處理器:ARM? Cortex?-M3 核心尺寸:32-位 速度:48MHz 連接性:I2C,IrDA,智能卡,SPI,UART/USART 外設(shè):欠壓檢測/復(fù)位,DMA,POR,PWM,WDT I/O 數(shù):56 程序存儲容量:1MB(1M x 8) 程序存儲器類型:閃存 EEPROM 容量:- RAM 容量:128K x 8 電壓 - 電源(Vcc/Vdd):1.98 V ~ 3.8 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 8x12b,D/A 2x12b 振蕩器類型:內(nèi)部 工作溫度:-40°C ~ 85°C(TA) 封裝/外殼:64-VFQFN 裸露焊盤 供應(yīng)商器件封裝:64-QFN(9x9) 標(biāo)準(zhǔn)包裝:1
EFM32GG230F1024-QFN64 制造商:Energy Micro AS 功能描述:GIANT GECKO MCU - Cut TR (SOS) 制造商:Energy Micro 功能描述:GIANT GECKO MCU 制造商:Energy Micro AS 功能描述:IC MCU 32BIT 1MB FLASH 64QFN
EFM32GG230F1024-QFN64T 制造商:Energy Micro AS 功能描述:GIANT GECKO MCU - Trays
EFM32GG230F1024-QFN64-T 制造商:Energy Micro AS 功能描述:IC MCU 32BIT 1MB FLASH 64QFN
EFM32-GG230F1024-SK 制造商:Energy Micro AS 功能描述:GIANT GECKO SAMPLE KIT - Bulk