參數(shù)資料
型號(hào): EFM32G840F64
廠商: Energy Micro
文件頁(yè)數(shù): 64/69頁(yè)
文件大?。?/td> 0K
描述: MCU 32BIT 64KB FLASH 64-QFN
標(biāo)準(zhǔn)包裝: 1,000
系列: Gecko
核心處理器: ARM? Cortex?-M3
芯體尺寸: 32-位
速度: 32MHz
連通性: EBI/EMI,I²C,IrDA,智能卡,SPI,UART/USART
外圍設(shè)備: 欠壓檢測(cè)/復(fù)位,DMA,LCD,POR,PWM,WDT
輸入/輸出數(shù): 56
程序存儲(chǔ)器容量: 64KB(64K x 8)
程序存儲(chǔ)器類型: 閃存
RAM 容量: 16K x 8
電壓 - 電源 (Vcc/Vdd): 1.8 V ~ 3.8 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 8x12b,D/A 2x12b
振蕩器型: 外部
工作溫度: -40°C ~ 85°C
封裝/外殼: 64-VFQFN 裸露焊盤
包裝: 帶卷 (TR)
其它名稱: EFM32G840F64-QFN64
...the world's most energy friendly microcontrollers
2013-06-28 - EFM32G840FXX - d0008_Rev1.60
67
www.energymicro.com
List of Tables
1.1. Ordering Information ................................................................................................................................ 2
2.1. Configuration Summary ............................................................................................................................ 6
3.1. Absolute Maximum Ratings ...................................................................................................................... 9
3.2. General Operating Conditions ................................................................................................................... 9
3.3. Environmental ....................................................................................................................................... 10
3.4. Current Consumption ............................................................................................................................. 11
3.5. Energy Modes Transitions ...................................................................................................................... 18
3.6. Power Management ............................................................................................................................... 19
3.7. Flash .................................................................................................................................................. 19
3.8. GPIO .................................................................................................................................................. 20
3.9. LFXO .................................................................................................................................................. 27
3.10. HFXO ................................................................................................................................................ 28
3.11. LFRCO .............................................................................................................................................. 28
3.12. HFRCO ............................................................................................................................................. 30
3.13. ULFRCO ............................................................................................................................................ 32
3.14. ADC .................................................................................................................................................. 32
3.15. DAC .................................................................................................................................................. 41
3.16. ACMP ............................................................................................................................................... 43
3.17. VCMP ............................................................................................................................................... 45
3.18. LCD .................................................................................................................................................. 46
3.19. Digital Peripherals ............................................................................................................................... 46
4.1. Device Pinout ....................................................................................................................................... 48
4.2. Alternate functionality overview ................................................................................................................ 51
4.3. GPIO Pinout ........................................................................................................................................ 54
4.4. QFN64 (Dimensions in mm) .................................................................................................................... 55
5.1. QFN64 PCB Land Pattern Dimensions (Dimensions in mm) .......................................................................... 56
5.2. QFN64 PCB Solder Mask Dimensions (Dimensions in mm) ........................................................................... 57
5.3. QFN64 PCB Stencil Design Dimensions (Dimensions in mm) ........................................................................ 58
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