參數(shù)資料
型號(hào)： EFM32G200F64
廠商： Energy Micro
文件頁數(shù)： 59/64頁
文件大?。?/td> 0K
描述： MCU 32BIT 64KB FLASH 32-QFN
標(biāo)準(zhǔn)包裝： 1,000
系列： Gecko
核心處理器： ARM? Cortex?-M3
芯體尺寸： 32-位
速度： 32MHz
連通性： EBI/EMI，I²C，IrDA，智能卡，SPI，UART/USART
外圍設(shè)備： 欠壓檢測(cè)/復(fù)位，DMA，POR，PWM，WDT
輸入/輸出數(shù)： 24
程序存儲(chǔ)器容量： 64KB（64K x 8）
程序存儲(chǔ)器類型： 閃存
RAM 容量： 16K x 8
電壓 - 電源 (Vcc/Vdd)： 1.8 V ~ 3.8 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 4x12b，D/A 1x12b
振蕩器型： 外部
工作溫度： -40°C ~ 85°C
封裝/外殼： 32-VQFN 裸露焊盤
包裝： 帶卷 (TR)
其它名稱： EFM32G200F64-QFN32
...the world's most energy friendly microcontrollers
2013-06-28 - EFM32G200FXX - d0003_Rev1.60
62
www.energymicro.com
List of Tables
1.1. Ordering Information ................................................................................................................................ 2
2.1. Configuration Summary ............................................................................................................................ 6
3.1. Absolute Maximum Ratings ...................................................................................................................... 8
3.2. General Operating Conditions ................................................................................................................... 8
3.3. Environmental ........................................................................................................................................ 9
3.4. Current Consumption ............................................................................................................................. 10
3.5. Energy Modes Transitions ...................................................................................................................... 17
3.6. Power Management ............................................................................................................................... 18
3.7. Flash .................................................................................................................................................. 18
3.8. GPIO .................................................................................................................................................. 19
3.9. LFXO .................................................................................................................................................. 26
3.10. HFXO ................................................................................................................................................ 27
3.11. LFRCO .............................................................................................................................................. 27
3.12. HFRCO ............................................................................................................................................. 29
3.13. ULFRCO ............................................................................................................................................ 31
3.14. ADC .................................................................................................................................................. 31
3.15. DAC .................................................................................................................................................. 40
3.16. ACMP ............................................................................................................................................... 42
3.17. VCMP ............................................................................................................................................... 44
3.18. Digital Peripherals ............................................................................................................................... 44
4.1. Device Pinout ....................................................................................................................................... 46
4.2. Alternate functionality overview ................................................................................................................ 48
4.3. GPIO Pinout ........................................................................................................................................ 49
4.4. QFN32 (Preliminary) (Dimensions in mm) .................................................................................................. 50
5.1. QFN32 PCB Land Pattern Dimensions (Dimensions in mm) .......................................................................... 51
5.2. QFN32 PCB Solder Mask Dimensions (Dimensions in mm) ........................................................................... 52
5.3. QFN32 PCB Stencil Design Dimensions (Dimensions in mm) ........................................................................ 53
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EFM32G200F64-QFN32 制造商:Energy Micro AS 功能描述:MCU, 64K FLASH, USART+UART 2, QFN32 - Cut TR (SOS) 制造商:Energy Micro AS 功能描述:IC MCU 32BIT 64KB FLASH 32QFN
EFM32G200F64-QFN32T 制造商:Energy Micro AS 功能描述:32 BIT ARM MPU, GECKO - Trays
EFM32G200F64-QFN32-T 制造商:Energy Micro AS 功能描述:IC MCU 32BIT 64KB FLASH 32QFN
EFM32G200F64-T 制造商:Energy Micro AS 功能描述:IC MCU 32BIT 64KB FLASH 32QFN
EFM32G210F128 功能描述:ARM微控制器 - MCU 128KB FLASH 16KB RAM 32MHZ 1.8-3.8V RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 處理器系列:STM32F373xx 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:72 MHz 程序存儲(chǔ)器大小:256 KB 數(shù)據(jù) RAM 大小:32 KB 片上 ADC:Yes 工作電源電壓:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:LQFP-48 安裝風(fēng)格:SMD/SMT
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