參數(shù)資料
型號(hào)： EFM32G200F32
廠商： Energy Micro
文件頁(yè)數(shù)： 58/64頁(yè)
文件大?。?/td> 0K
描述： MCU 32BIT 32KB FLASH 32-QFN
標(biāo)準(zhǔn)包裝： 1,000
系列： Gecko
核心處理器： ARM? Cortex?-M3
芯體尺寸： 32-位
速度： 32MHz
連通性： EBI/EMI，I²C，IrDA，智能卡，SPI，UART/USART
外圍設(shè)備： 欠壓檢測(cè)/復(fù)位，DMA，POR，PWM，WDT
輸入/輸出數(shù)： 24
程序存儲(chǔ)器容量： 32KB（32K x 8）
程序存儲(chǔ)器類型： 閃存
RAM 容量： 8K x 8
電壓 - 電源 (Vcc/Vdd)： 1.8 V ~ 3.8 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 4x12b，D/A 1x12b
振蕩器型： 外部
工作溫度： -40°C ~ 85°C
封裝/外殼： 32-VQFN 裸露焊盤
包裝： 帶卷 (TR)
其它名稱： EFM32G200F32-QFN32
...the world's most energy friendly microcontrollers
2013-06-28 - EFM32G200FXX - d0003_Rev1.60
61
www.energymicro.com
List of Figures
2.1. Block Diagram ....................................................................................................................................... 3
2.2. EFM32G200 Memory Map with largest RAM and Flash sizes .......................................................................... 7
28MHz ..................................................................................................................................................... 11
21MHz ..................................................................................................................................................... 11
14MHz ..................................................................................................................................................... 12
11MHz ..................................................................................................................................................... 12
7MHz ....................................................................................................................................................... 13
3.11. EM2 current consumption. RTC prescaled to 1kHz, 32 kHz LFRCO. ............................................................. 16
3.12. EM3 current consumption. ................................................................................................................... 16
3.13. EM4 current consumption. ................................................................................................................... 17
3.14. Typical Low-Level Output Current, 2V Supply Voltage ................................................................................ 20
3.15. Typical High-Level Output Current, 2V Supply Voltage ................................................................................ 21
3.16. Typical Low-Level Output Current, 3V Supply Voltage ................................................................................ 22
3.17. Typical High-Level Output Current, 3V Supply Voltage ................................................................................ 23
3.18. Typical Low-Level Output Current, 3.8V Supply Voltage .............................................................................. 24
3.19. Typical High-Level Output Current, 3.8V Supply Voltage ............................................................................. 25
3.20. Calibrated LFRCO Frequency vs Temperature and Supply Voltage .............................................................. 28
3.25. Integral Non-Linearity (INL) ................................................................................................................... 35
3.26. Differential Non-Linearity (DNL) .............................................................................................................. 36
3.27. ADC Frequency Spectrum, Vdd = 3V, Temp = 25° ................................................................................... 37
3.28. ADC Integral Linearity Error vs Code, Vdd = 3V, Temp = 25° ..................................................................... 38
3.29. ADC Differential Linearity Error vs Code, Vdd = 3V, Temp = 25° ................................................................. 39
3.30. ADC Absolute Offset, Common Mode = Vdd /2 ........................................................................................ 40
3.32. Typical ACMP Characteristics ............................................................................................................... 43
4.1. EFM32G200 Pinout (top view, not to scale) ............................................................................................... 46
4.2. QFN32 ................................................................................................................................................ 50
5.1. QFN32 PCB Land Pattern ...................................................................................................................... 51
5.2. QFN32 PCB Solder Mask ....................................................................................................................... 52
5.3. QFN32 PCB Stencil Design .................................................................................................................... 53
6.1. Example Chip Marking ........................................................................................................................... 54
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EFM32G200F32-QFN32 制造商:Energy Micro AS 功能描述:MCU, 32K FLASH, USART+UART 2, QFN32 - Tape and Reel 制造商:Energy Micro AS 功能描述:IC MCU 32BIT 32KB FLASH 32QFN
EFM32G200F32-QFN32T 制造商:Energy Micro AS 功能描述:32 BIT ARM MPU, GECKO - Trays
EFM32G200F32-QFN32-T 制造商:Energy Micro AS 功能描述:IC MCU 32BIT 32KB FLASH 32QFN
EFM32G200F32-T 制造商:Energy Micro AS 功能描述:IC MCU 32BIT 32KB FLASH 32QFN
EFM32G200F64 功能描述:ARM微控制器 - MCU 64KB FLASH 16KB RAM 32MHZ 1.8-3.8V RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 處理器系列:STM32F373xx 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:72 MHz 程序存儲(chǔ)器大小:256 KB 數(shù)據(jù) RAM 大小:32 KB 片上 ADC:Yes 工作電源電壓:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:LQFP-48 安裝風(fēng)格:SMD/SMT
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