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參數(shù)資料
| 型號： | ECG050C |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | InGaP HBT Gain Block |
| 中文描述： | InGaP HBT增益模塊 |
| 文件頁數(shù)： | 5/7頁 |
| 文件大小： | 315K |
| 代理商： | ECG050C |
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com
December 2004
ECG050
InGaP HBT Gain Block
Product Information
The Communications Edge
TM
ECG050B-G (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260
q
C reflow temperature) and leaded
(maximum 245
q
C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Land Pattern
Product Marking
The component will be marked with an
“E050G” designator with an alphanumeric lot
code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1A
Value:
Test:
Standard:
MSL Rating: Level 3 at +260 C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ECG050C-PCB | InGaP HBT Gain Block |
| ECG055 | The Communications Edge |
| ECG055B | The Communications Edge |
| ECG055B-G | The Communications Edge |
| ECG055B-PCB | The Communications Edge |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ECG050C-PCB | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:InGaP HBT Gain Block |
| ECG055 | 制造商:WJCI 制造商全稱:WJCI 功能描述:The Communications Edge |
| ECG055B | 制造商:WJCI 制造商全稱:WJCI 功能描述:InGaP HBT Gain Block |
| ECG055B_07 | 制造商:WJCI 制造商全稱:WJCI 功能描述:InGaP HBT Gain Block |
| ECG055B-G | 功能描述:射頻放大器 DC-3 GHz 20.5dB Gain@1 GHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
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