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參數(shù)資料
| 型號： | ECG002F-G |
| 英文描述： | InGaP HBT Gain Block |
| 中文描述： | InGaP HBT增益模塊 |
| 文件頁數(shù)： | 6/7頁 |
| 文件大小： | 254K |
| 代理商： | ECG002F-G |
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com
Page 6 of 7 April 2006
ECG002
InGaP HBT Gain Block
Product Information
The Communications Edge
TM
ECG002F-G Mechanical Information
This package is lead-free/Green/RoHS-compliant. The plating material on the leads is annealed matte tin over copper. It is compatible with
both lead-free (maximum 260
°C reflow temperature) and leaded (maximum 245 °C reflow temperature) soldering processes.
Outline Drawing
Land Pattern
Product Marking
The component will be marked with a two-digit
numeric lot code (shown as “XX”) followed
with a “5” designator on the top surface of the
package.
The obsolete tin-lead package is
marked with a two-digit numeric lot code
followed with a “1” designator; it may also
have been marked with a “10” designator
followed by a letter lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1A
Value:
Passes between 250 and 500V
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260
°C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this
device. Vias should use a .35mm (#80 / .0135”) diameter drill and
have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near the
part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in degrees.
相關PDF資料 |
PDF描述 |
|---|---|
| ECG002F-PCB | InGaP HBT Gain Block |
| ECG015* | |
| ECG040B-G | InGaP HBT Gain Block |
| ECG040B-PCB | InGaP HBT Gain Block |
| ECG055C-G | InGaP HBT Gain Block |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| ECG002F-PCB | 功能描述:射頻開發(fā)工具 700-2400MHz Eval Brd 20dB Gain RoHS:否 制造商:Taiyo Yuden 產(chǎn)品:Wireless Modules 類型:Wireless Audio 工具用于評估:WYSAAVDX7 頻率: 工作電源電壓:3.4 V to 5.5 V |
| ECG002FTR-G | 制造商:TriQuint Semiconductor 功能描述:GAIN BLOCK |
| ECG003 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:InGaP HBT Gain Block |
| ECG003B | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:InGaP HBT Gain Block |
| ECG003B-G | 功能描述:射頻放大器 DC-6 GHz +24dBm P1dB@1 GHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
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