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參數(shù)資料
| 型號： | EC3900TTS-02.500MTR |
| 廠商： | ECLIPTEK CORP |
| 元件分類： | XO, clock |
| 英文描述： | CRYSTAL OSCILLATOR, CLOCK, 2.5 MHz, HCMOS OUTPUT |
| 封裝： | ROHS COMPLIANT, CERAMIC, SMD, 4 PIN |
| 文件頁數(shù)： | 2/2頁 |
| 文件大小： | 121K |
| 代理商： | EC3900TTS-02.500MTR |
MANUFACTURER
CATEGORY
SERIES
PACKAGE
VOLTAGE
CLASS
REV
.DATE
ECLIPTEK CORP.
OSCILLATOR
EC39
CERAMIC
1.8V
OS1F
08/08
EC39 00 ET T TS - 30.000M TR
FREQUENCY TOLERANCE / STABILITY
00=±100ppm Maximum (Standard)
45=±50ppm Maximum
25=±25ppm Maximum
20=±20ppm Maximum
OPERATING TEMPERATURE RANGE
Blank=-10°C to 70°C (Standard)
ET=-40°C to 85°C
PART NUMBERING GUIDE
*Compliant to EIA 481A
MECHANICAL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
MARKING SPECIFICATIONS
ENVIRONMENTAL/MECHANICAL SPECIFICATIONS
SUGGESTED SOLDER PAD LAYOUT
ALL DIMENSIONS IN MILLIMETERS
TAPE AND REEL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
Tolerances= +0.1
800-ECLIPTEK www.ecliptek.com for latest revision
Specifications subject to change without notice.
Pin 1: Tri-State
Pin 2: Case Ground
Pin 3: Output
Pin 4: Supply Voltage
PACKAGING OPTIONS
Blank=Bulk (Standard)
TR=Tape and Reel
FREQUENCY
DUTY CYCLE
Blank=50 ±10(%) (Standard)
T=50 ±5(%)
MARKING
ORIENT
A
T
ION
3.20
±0.20
5.00
±0.20
1.3
MAX
Note: Pin 1 Chamfer not shown.
2.20
±0.15
2.54
±0.15
4
3
1
2
1.00 ±0.20 (x4)
1.20 ±0.20
1.20
±0.20
(x4)
M
N
O
P
Q
1.5 MIN
50 MIN
20.2 MIN 13.0±0.2
40 MIN
R
S
T
U
V
QTY/REEL
2.5 MIN
10 MIN
18.4 MAX
180 MAX
12.4+2-0
1,000
REEL
A
B
C
D
E
F
16.0±0.3
7.5±0.1
6.75±0.1
4.0±0.1
2.0±0.1
F
G
H
J
K
L
8.0±0.1
B0* 1.5 +0.1-0.0
A0*
0.30 ±0.1
K0*
TAPE
Line 1: E XX.XXX
Frequency in MHz (5 Digits Maximum + Decimal)
Line 2: XX Y ZZ
Week of Year
Last Digit of Year
Ecliptek Manufacturing Identifier
Characteristic
Specification
ESD Susceptibility
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
Fine Leak Test
MIL-STD-883, Method 1014, Condition A
Flammability
UL94-V0
Gross Leak Test
MIL-STD-883, Method 1014, Condition C
Mechanical Shock
MIL-STD-883, Method 2002, Condition B
Moisture Resistance
MIL-STD-883, Method 1004
Moisture Sensitivity
J-STD-020, MSL 1
Resistance to Soldering Heat
MIL-STD-202, Method 210, Condition K
Resistance to Solvents
MIL-STD-202, Method 215
Solderability
MIL-STD-883, Method 2003
Temperature Cycling
MIL-STD-883, Method 1010, Condition B
Vibration
MIL-STD-883, Method 2007, Condition A
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