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參數(shù)資料
| 型號(hào)： | EC1089B |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | InGaP HBT Gain Block |
| 中文描述： | InGaP HBT增益模塊 |
| 文件頁(yè)數(shù)： | 6/6頁(yè) |
| 文件大?。?/td> | 331K |
| 代理商： | EC1089B |
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com
December 2004
EC1089
Watt, High Linearity InGaP HBT Amplifier
Product Information
The Communications Edge
TM
EC1089B-G (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260
q
C reflow temperature) and leaded
(maximum 245
q
C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Land Pattern
Product Marking
The component will be marked with an
“1089G” designator with an alphanumeric lot
code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1A
Value:
Test:
Standard:
MSL Rating: Level 3 at +260 C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance
(1)
Junction Temperature
(2)
Notes:
1. The thermal resistance is referenced from the junction-
to-case at a case temperature of 85 C.
2. This corresponds to the typical biasing condition of +5V,
160 mA at an 85 C case temperature. A minimum
MTTF of 1 million hours is achieved for junction
temperatures below 247 C.
Rating
-40 to +85
q
C
149
q
C / W
204
q
C
MTTF vs. GND Tab Temperature
1.0
10.0
100.0
1000.0
60
70
80
90
100
110
120
Tab Temperature (°C)
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PDF描述 |
|---|---|
| EC1089B-G | InGaP HBT Gain Block |
| EC1089B-PCB1900 | InGaP HBT Gain Block |
| EC1089B-PCB2140 | InGaP HBT Gain Block |
| EC1089B-PCB900 | InGaP HBT Gain Block |
| EC2C03C | Diffused Junction Type Silicon Diode Variable Capacitance Diode for UHF Band VCO |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| EC-1089B-G | 制造商:TriQuint Semiconductor 功能描述:GAIN BLOCK |
| EC1089B-G | 功能描述:射頻放大器 10-2500MHz 15.5dB Gain@900MHz RoHS:否 制造商:Skyworks Solutions, Inc. 類(lèi)型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類(lèi)型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測(cè)試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| EC1089B-PCB1900 | 功能描述:射頻開(kāi)發(fā)工具 1900MHz Eval Brd 12.5dB RoHS:否 制造商:Taiyo Yuden 產(chǎn)品:Wireless Modules 類(lèi)型:Wireless Audio 工具用于評(píng)估:WYSAAVDX7 頻率: 工作電源電壓:3.4 V to 5.5 V |
| EC1089B-PCB2140 | 功能描述:射頻開(kāi)發(fā)工具 2140MHz Eval Brd 11.5dB RoHS:否 制造商:Taiyo Yuden 產(chǎn)品:Wireless Modules 類(lèi)型:Wireless Audio 工具用于評(píng)估:WYSAAVDX7 頻率: 工作電源電壓:3.4 V to 5.5 V |
| EC1089B-PCB900 | 功能描述:射頻開(kāi)發(fā)工具 900MHz Eval Brd 15.5dB RoHS:否 制造商:Taiyo Yuden 產(chǎn)品:Wireless Modules 類(lèi)型:Wireless Audio 工具用于評(píng)估:WYSAAVDX7 頻率: 工作電源電壓:3.4 V to 5.5 V |
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