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參數(shù)資料
| 型號： | EC1078B-G |
| 英文描述： | InGaP HBT Gain Block |
| 中文描述： | InGaP HBT增益模塊 |
| 文件頁數(shù)： | 4/4頁 |
| 文件大?。?/td> | 132K |
| 代理商： | EC1078B-G |
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com
Page 4 of 4 April 2006
EC1078
InGaP HBT Gain Block
Product Information
The Communications Edge
TM
EC1078B-G Mechanical Information
This package is lead-free/Green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free
(maximum 260
°C reflow temperature) and leaded (maximum 245°C reflow temperature) soldering processes.
Outline Drawing
Land Pattern
Product Marking
The component will be marked with an
“1078G” designator with an alphanumeric lot
code on the top surface of the package.
The
obsolete tin-lead package is marked with an
“1078”
designator
followed
by
an
alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1A
Value:
Passes between 250 and 500V
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260
°C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this
device. Vias should use a .35mm (#80 / .0135”) diameter drill and
have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near the
part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in degrees.
相關(guān)PDF資料 |
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| EC1078B-PCB | InGaP HBT Gain Block |
| EC1078 | InGaP HBT Gain Block |
| EC1110 | Analog IC |
| EC1200 | Analog IC |
| EC1210 | Analog IC |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| EC1078B-PCB | 功能描述:射頻開發(fā)工具 700-2400MHz Eval Brd 20dB Gain RoHS:否 制造商:Taiyo Yuden 產(chǎn)品:Wireless Modules 類型:Wireless Audio 工具用于評估:WYSAAVDX7 頻率: 工作電源電壓:3.4 V to 5.5 V |
| EC-1078BTRG | 制造商:TriQuint Semiconductor 功能描述:GAIN BLOCK |
| EC1079-000 | 功能描述:電線鑒定 6181942 RoHS:否 制造商:TE Connectivity / Q-Cees 產(chǎn)品:Labels and Signs 類型: 材料:Vinyl 顏色:Blue 寬度:0.625 in 長度:1 in |
| EC1082-000 | 功能描述:電線鑒定 6183400 RoHS:否 制造商:TE Connectivity / Q-Cees 產(chǎn)品:Labels and Signs 類型: 材料:Vinyl 顏色:Blue 寬度:0.625 in 長度:1 in |
| EC1083-000 | 功能描述:電線鑒定 6183401 RoHS:否 制造商:TE Connectivity / Q-Cees 產(chǎn)品:Labels and Signs 類型: 材料:Vinyl 顏色:Blue 寬度:0.625 in 長度:1 in |
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