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參數(shù)資料
| 型號(hào)： | EB73DK6SGFXI |
| 廠商： | VISHAY DALE |
| 元件分類： | 邊緣插接連接器 |
| 英文描述： | 12 CONTACT(S), FEMALE, STRAIGHT SINGLE PART CARD EDGE CONN, SOLDER |
| 文件頁(yè)數(shù)： | 1/4頁(yè) |
| 文件大?。?/td> | 132K |
| 代理商： | EB73DK6SGFXI |
Edgeboard Connectors, Dual Readout
www.vishay.com
For technical questions, contact: connectors@vishay.com
Document Number: 36003
8
Revision: 16-Feb-09
EB7D
Vishay Dale
ELECTRICAL SPECIFICATIONS
Current Rating: 5 A
Test Voltage Between Contacts:
At sea level: 1800 VRMS
At 70 000 feet (21 336 meters): 450 VRMS
Insulation Resistance: 5000 M
Ω minimum at 500 V
DC
potential
Contact Resistance: 30 mV maximum at rated current (with
gold plating)
Operating Temperature: - 55 °C to + 125 °C
Humidity: 96 h at 90 % relative humidity at + 40 °C, dried at
room temperature for 3 h minimum, insulation resistance
was greater than 5000 M
Ω
Durability: After 500 cycles of insertion and withdrawal of a
0.070" (1.78 mm) thick steel test gauge, contact resistance
less than 0.030 V at 5 A and individual contact retention force
when measured with 0.054" (1.37 mm) thick steel test slug
greater than oz.
Shock:
Three
50G
shocks
in
each
of
3
mutually
perpendicular planes with no loss of continuity
Vibration: 2 h in each of 3 mutually perpendicular planes,
frequency sweep 10 cps to 55 cps at 0.06 double amplitude
with no loss of continuity
PHYSICAL SPECIFICATIONS
Contact Type: Bifurcated bellows
Number of Contacts: 6, 10, 12, 15, 18, 22, 36, 43 per side
Contact Spacing: 0.156" (3.96 mm) center to center
Card Thickness: 0.054" to 0.071" (1.37 mm to 1.80 mm)
Card Slot Depth: Dual readout = 0.260" (6.60 mm)
Note
High
temperature
burn-in,
edgeboard
connectors,
0.156"
(3.96 mm) center to center are on www.vishay.com/doc?36006
FEATURES
0.156" C-C x 0.140" grid (3.96 mm x 3.56 mm)
Bifurcated bellows contacts provide 2 flexing contact
surfaces to assure positive contact under adverse
conditions such as vibration or PC board irregularities
Accepts PC board thickness of 0.054" to 0.071" (1.37 mm
to 1.80 mm)
Polarization between contact positions in all sizes.
Between contact polarization permits polarizing without
loss of contact position
Selective gold plating
Polarizing key is reinforced nylon, may be inserted by
hand, requires no adhesive.
Protected entry, provided by recessed leading edge of
contact, permits the card slot to straighten and align the
board before electrical contact is made. Prevents damage
to contact which might be caused by warped or out of
tolerance boards
Recognized
under
the
Component
Program
of
Underwriters Laboratories, Inc. listed under file
E65524, project 77CH3889
APPLICATIONS
For use with 0.062" (1.57 mm) printed circuit boards requiring
an edgeboard type connector on 0.156" (3.96 mm) centers
MATERIAL SPECIFICATIONS
Body: (Standard) glass-filled phenolic per MIL-M-14, dark
green, flame retardant (UL 94 V-0). (Optional - see Ordering
Information)
“1” glass-filled diallyl phtalate per MIL-M-14, type SDG-F
green, flame retardant (UL 94 V-0)
“3”
thermoplastic
polyester,
glass-filled,
black,
flame
retardant (UL 94 V-0)
”5” thermoplastic polyphenylene sulfied, glass filled, brown,
flame retardant (UL 94 V-0)
Contacts: Phosphor bronze
Polarizing Key: Glass reinforced nylon, flame retardant
(UL 94H-B)
Contact Plating: Gold (See Ordering Information)
ORDERING INFORMATION
EB7
1
D
B
A
22
SG
X
A
MODEL
BODY
MATERIAL
Optional body
material
1 = Diallyl
Phthalate
3 = Glass-filled
Polyester
5 = Glass-filled
Polyphenylene
Sulfied
= Omit number
for standard
pheniolic
DUAL
READOUT
OPTIONAL
CONTACTS
Beryllium
Copper
copntacts
optional
Available in
“A” and “E”
contact
styles only
(Omit for
standard)
STANDARD
TERMINAL
VARIATIONS
A, E, C,
or K
CONTACTS
PER SIDE
6, 10, 12,
15, 18, 22,
36, or 43
CONTACT PLATING
SG = Selective gold plating
(0.00003" (0.000762 mm)
minimum thick) on contact
area with gold flash on
terminal
SGF = Selective gold plating
(0.000010" (0.000254 mm)
minimum thick) on contact
area with gold flash on
terminal.
All gold plating over
0.00005" (0.00127 mm)
minimum nickel underplate.
Contact factory for additional
plating options.
MOUNTING
VARIATIONS
POLARIZING
KEY POSITIONS
Key(s) are located
to right of position(s)
designated.
Required only when
polarizing keys are
to be factory
installed
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參數(shù)描述 |
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| EB73D-SA1040W | 功能描述:標(biāo)準(zhǔn)卡緣連接器 EB73D-A10SGFWT02 RoHS:否 制造商:3M Electronic Solutions Division 系列:SPD08 產(chǎn)品類型:Contacts 位置/觸點(diǎn)數(shù)量:60 安裝角:Straight 電路板厚度: 安裝風(fēng)格:SMD/SMT 節(jié)距:8 mm 外殼材料:Liquid Crystal Polymer (LCP) 觸點(diǎn)材料:Copper Alloy 觸點(diǎn)電鍍:Gold |
| EB73D-SA1040X | 功能描述:標(biāo)準(zhǔn)卡緣連接器 EB73D-A10SGFXT02 RoHS:否 制造商:3M Electronic Solutions Division 系列:SPD08 產(chǎn)品類型:Contacts 位置/觸點(diǎn)數(shù)量:60 安裝角:Straight 電路板厚度: 安裝風(fēng)格:SMD/SMT 節(jié)距:8 mm 外殼材料:Liquid Crystal Polymer (LCP) 觸點(diǎn)材料:Copper Alloy 觸點(diǎn)電鍍:Gold |
| EB73D-SA1240X | 功能描述:標(biāo)準(zhǔn)卡緣連接器 EB73D-A12SGFXT02 RoHS:否 制造商:3M Electronic Solutions Division 系列:SPD08 產(chǎn)品類型:Contacts 位置/觸點(diǎn)數(shù)量:60 安裝角:Straight 電路板厚度: 安裝風(fēng)格:SMD/SMT 節(jié)距:8 mm 外殼材料:Liquid Crystal Polymer (LCP) 觸點(diǎn)材料:Copper Alloy 觸點(diǎn)電鍍:Gold |
| EB73D-SA1240X-J | 功能描述:標(biāo)準(zhǔn)卡緣連接器 RoHS:否 制造商:3M Electronic Solutions Division 系列:SPD08 產(chǎn)品類型:Contacts 位置/觸點(diǎn)數(shù)量:60 安裝角:Straight 電路板厚度: 安裝風(fēng)格:SMD/SMT 節(jié)距:8 mm 外殼材料:Liquid Crystal Polymer (LCP) 觸點(diǎn)材料:Copper Alloy 觸點(diǎn)電鍍:Gold |
| EB73D-SA1540X | 功能描述:標(biāo)準(zhǔn)卡緣連接器 EB73D-A15SGFXT02 RoHS:否 制造商:3M Electronic Solutions Division 系列:SPD08 產(chǎn)品類型:Contacts 位置/觸點(diǎn)數(shù)量:60 安裝角:Straight 電路板厚度: 安裝風(fēng)格:SMD/SMT 節(jié)距:8 mm 外殼材料:Liquid Crystal Polymer (LCP) 觸點(diǎn)材料:Copper Alloy 觸點(diǎn)電鍍:Gold |
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