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參數資料
| 型號： | E846-EDGE846 |
| 英文描述： | Pin Electronics Driver. Window Comparator. and Switch Matrix |
| 中文描述： | 引腳電子驅動程序。窗口比較器。和開關矩陣 |
| 文件頁數： | 13/14頁 |
| 文件大?。?/td> | 100K |
| 代理商： | E846-EDGE846 |
8
Revision 2 / October 21, 2002
www .semtech.com
TEST AND MEASUREMENT PRODUCTS
Edge846
Package Information (continued)
3
DETAIL "A"
e / 2
b
0 MIN.
0.08 / 0.20 R.
GAUGE PLANE
0.25
0 – 7
L
C.08
R. MIN.
0.20 MIN.
1.00 REF.
DATUM
PLANE
– H –
A1
0.05
A2
–
S
DETAIL "B"
9
;;;
SS
D
C
ddd
M
A – B
WITH LEAD FINISH
Lead
Cross Section
0.09 / 0.20
0.09 / 0.16
b
1
BASE METAL
2
8 PLACES
11 / 13
A
0.10
/ /
C
M
SEE DETAIL "B"
0.05
ccc
– H –
– C –
SECTION C–C
Notes:
1.
All dimensions and tolerances conform to ANSI Y14.5-1982.
2.
Datum plane -H- located at mold parting line and coincident with
lead, where lead exits plastic body at bottom of parting line.
3.
Datums A-B and -D- to be determined at centerline between leads
where leads exit plastic body at datum plane -H-.
4.
To be determined at seating plane -C-.
5.
Dimensions D1 and E1 do not include mold protrusion.
6.
“N” is the total # of terminals.
7.
These dimensions to be determined at the datum plane -H-.
8.
Package top dimensions are smaller than bottom dimensions and
top of package will not overhang bottom of package.
9.
Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08 mm total in excess of the b
dimension at maximum material condition. Dambar cannot be
located on the lower radius or the foot.
10.
Controlling dimension: millimeter.
11.
Maximum allowable die thickness to be assembled in this
package family is 0.30 millimeters.
12.
This outline conforms to JEDEC publication 95, registration
MO-136, variations AC, AE, and AF.
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