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參數(shù)資料
| 型號： | E728-EDGE728 |
| 英文描述： | Very High-Speed Dual- and Quad-Channel ECL Delay Lines |
| 中文描述： | 極高速雙和四通道ECL延遲線 |
| 文件頁數(shù)： | 3/18頁 |
| 文件大小： | 133K |
| 代理商： | E728-EDGE728 |
11
2000 Semtech Corp.
www .semtech.com
HIGH-PERFORMANCE PRODUCTS – ATE
Edge728
Package Information (continued)
–A, B, D–
3
DETAIL "A"
e
A2
A1
0.13
R. MIN.
0.40 MIN.
0 MIN.
0 – 7
C
0.13 / 0.30 R.
L
1.60 REF.
GAGE PLANE
0.10 S
–
0.25
DETAIL "B"
12 – 16
1.41 REF.
SEE DETAIL "B"
12 – 16
A
H
C
2
0.076
8
0.13 / 0.23
0.13 / 0.17
12
BASE METAL
WITH LEAD FINISH
b
1
ccc
M
S
A – B
D
C
SECTION C-C
Notes:
1.
All dimensions and tolerances conform to
ANSI Y14.5-1982.
2.
Datum plane -H- located at mold parting line and
coincident with lead, where lead exits plastic body
at bottom of parting line.
3.
Datums A-B and -D- to be determined where
centerline between leads exits plastic body at datum
plane -H-.
4.
To be determined at seating plane -C-.
5.
Dimensions D1 and E1 do not include mold
protrusion. Allowable mold protrusion is 0.254 mm
per side. Dimensions D1 and E1 do include mold
mismatch and are determined at datum plane -H-.
6.
“N” is the total # of terminals.
7.
Package top dimensions are smaller than bottom
dimensions by 0.20 mm, and top of package will
not overhang bottom of package.
8.
Dimension b does not include dambar protrusion.
Allowable dambar protrusion shall be 0.08 mm total
in excess of the b dimension at maximum material
condition.
Dambar cannot be located on the lower
radius or the foot.
9.
All dimensions are in millimeters.
10. Maximum allowable die thickness to be assembled
in this package family is 0.635 millimeters.
11. This drawing conforms to JEDEC registered outline
MS-108.
12. These dimensions apply to the flat section of the
lead between 0.10 mm and 0.25 mm from the lead tip.
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o
b
m
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Sn
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Nx
a
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B
DC
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3
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1
DC
S
B
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.
0
15
h
t
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e
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y
d
o
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2
DF
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0
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8
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ZF
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S
B
0
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.
3
14
1
EC
S
B
0
.
0
15
h
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i
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d
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B
2
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E
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8
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