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參數(shù)資料
| 型號： | E211ATF |
| 英文描述： | Buffer/Driver |
| 中文描述： | 緩沖器/驅(qū)動器 |
| 文件頁數(shù)： | 12/13頁 |
| 文件大?。?/td> | 87K |
| 代理商： | E211ATF |
8
2000 Semtech Corp.
www.semtech.com
HIGH-PERFORMANCE PRODUCTS – ATE
Edge211
Package Information (continued)
3
DETAIL "A"
e / 2
b
0 MIN.
0.08 / 0.20 R.
GAUGE PLANE
0.25
0 – 7
L
C.08
R. MIN.
0.20 MIN.
1.00 REF.
DATUM
PLANE
– H –
A2
0.05
A1
–
S
DETAIL "B"
9
;;;
SS
D
C
ddd
M
A – B
WITH LEAD FINISH
Lead
Cross Section
0.09 / 0.20
0.09 / 0.16
b
1
BASE METAL
2
8 PLACES
11 / 13
A
0.10
/ /
C
M
SEE DETAIL "B"
0.05
ccc
– H –
– C –
SECTION C–C
JEDEC VARIATION
All Dimensions in Millimeters
AC
Min.
Nom.
Max.
Note
A
1.60
A1
0.05
0.10
0.15
A2
1.35
1.40
1.45
D
9.00
BSC.
4
D1
7.00
BSC.
7,8
E
9.00
BSC.
4
E1
7.00
BSC.
7,8
L
0.45
0.60
0.75
M
0.15
N32
e
0.80 BSC.
b
0.30
0.37
0.45
9
b1
0.30
0.35
0.40
ccc
0.10
ddd
0.20
Notes:
1.
All dimensions and tolerances conform to ANSI
Y14.5-1982.
2.
Datum plane -H- located at mold parting line and
coincident with lead, where lead exits plastic
body at bottom of parting line.
3.
Datums A-B and -D- to be determined at
centerline between leads where leads exit
plastic body at datum plane -H-.
4.
To be determined at seating plane -C-.
5.
Dimensions D1 and E1 do not include mold
protrusion.
6.
“N” is the total # of terminals.
7.
These dimensions to be determined at the
datum plane -H-.
8.
Package top dimensions are smaller than
bottom dimensions and top of package will
not overhang bottom of package.
9.
Dimension b does not include dambar
protrusion. Allowable dambar protrusion
shall be 0.08 mm total in excess of the b
dimension at maximum material condition.
Dambar cannot be located on the lower
radius or the foot.
10.
Controlling dimension: millimeter.
11.
Maximum allowable die thickness to be
assembled in this package family is 0.30
millimeters.
12.
This outline conforms to JEDEC publication 95,
registration MO-136, variations AC, AE, and AF.
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