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參數(shù)資料
| 型號(hào)： | E-L6917BD |
| 廠商： | STMICROELECTRONICS |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | SWITCHING CONTROLLER, 600 kHz SWITCHING FREQ-MAX, PDSO28 |
| 封裝： | ROHS COMPLIANT, SO-28 |
| 文件頁數(shù)： | 11/33頁 |
| 文件大?。?/td> | 465K |
| 代理商： | E-L6917BD |
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L6917B
LAYOUT GUIDELINES
Since the device manages control functions and high-current drivers, layout is one of the most important things
to consider when designing such high current applications.
A good layout solution can generate a benefit in lowering power dissipation on the power paths, reducing radi-
ation and a proper connection between signal and power ground can optimise the performance of the control
loops.
Integrated power drivers reduce components count and interconnections between control functions and drivers,
reducing the board space.
Here below are listed the main points to focus on when starting a new layout and rules are suggested for a cor-
rect implementation.
s
Power Connections.
These are the connections where switching and continuous current flows from the input supply towards the load.
The first priority when placing components has to be reserved to this power section, minimizing the length of
each connection as much as possible.
To minimize noise and voltage spikes (EMI and losses) these interconnections must be a part of a power plane
and anyway realized by wide and thick copper traces. The critical components, i.e. the power transistors, must
be located as close as possible, together and to the controller. Considering that the ”electrical” components re-
ported in fig. 13 are composed by more than one ”physical” component, a ground plane or ”star” grounding con-
nection is suggested to minimize effects due to multiple connections.
Figure 13. Power connections and related connections layout guidelines (same for both phases)
Fig. 13a shows the details of the power connections involved and the current loops. The input capacitance
(CIN), or at least a portion of the total capacitance needed, has to be placed close to the power section in order
to eliminate the stray inductance generated by the copper traces. Low ESR and ESL capacitors (electrolytic or
Ceramic or both) are required.
s
Power Connections Related.
Fig.13b shows some small signal components placement, and how and where to mix signal and power ground
planes.
The distance from drivers and mosfet gates should be reduced as much as possible. Propagation delay times
R
F
R
FB
V
OS C
V
IN
----------------------------------
ω
T
L
2R
DROOP
ESR
+
()
------------------------------------------------------- -
5
4
---
=
C
F
Co
L
2
---
R
F
--------------------
=
VIN
LOAD
HS
Rgate
LS
Rgate
HGATEx
PHASEx
LGATEx
PGNDx
CIN
COUT
L
D
CBOOTx
VIN
LOAD
HS
LS
BOOTx
PHASEx
VCC
SGND
CIN
COUT
L
D
+VCC
CVCC
a. PCB power and ground planes areas
b. PCB small signal components placement
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| E-L6917BDTR | 功能描述:DC/DC 開關(guān)控制器 Prog Dual-Phase Cont RoHS:否 制造商:Texas Instruments 輸入電壓:6 V to 100 V 開關(guān)頻率: 輸出電壓:1.215 V to 80 V 輸出電流:3.5 A 輸出端數(shù)量:1 最大工作溫度:+ 125 C 安裝風(fēng)格: 封裝 / 箱體:CPAK |
| E-L6919E | 功能描述:電流型 PWM 控制器 5-Bit Dual Ph Contlr RoHS:否 制造商:Texas Instruments 開關(guān)頻率:27 KHz 上升時(shí)間: 下降時(shí)間: 工作電源電壓:6 V to 15 V 工作電源電流:1.5 mA 輸出端數(shù)量:1 最大工作溫度:+ 105 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSSOP-14 |
| E-L6919ETR | 功能描述:電流型 PWM 控制器 5-Bit Dual Ph Contlr RoHS:否 制造商:Texas Instruments 開關(guān)頻率:27 KHz 上升時(shí)間: 下降時(shí)間: 工作電源電壓:6 V to 15 V 工作電源電流:1.5 mA 輸出端數(shù)量:1 最大工作溫度:+ 105 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSSOP-14 |
| E-L6920D | 功能描述:直流/直流開關(guān)轉(zhuǎn)換器 0.6 to 5.5V Step-Up RoHS:否 制造商:STMicroelectronics 最大輸入電壓:4.5 V 開關(guān)頻率:1.5 MHz 輸出電壓:4.6 V 輸出電流:250 mA 輸出端數(shù)量:2 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT |
| E-L6920DTR | 功能描述:直流/直流開關(guān)轉(zhuǎn)換器 0.6 to 5.5V Step-Up RoHS:否 制造商:STMicroelectronics 最大輸入電壓:4.5 V 開關(guān)頻率:1.5 MHz 輸出電壓:4.6 V 輸出電流:250 mA 輸出端數(shù)量:2 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT |
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