- 您現(xiàn)在的位置：買(mǎi)賣(mài)IC網(wǎng) > PDF目錄3807 > DSPIC30F6011A-30I/PT (Microchip Technology)IC DSPIC MCU/DSP 132K 64TQFP PDF資料下載
參數(shù)資料
| 型號(hào)： | DSPIC30F6011A-30I/PT |
| 廠商： | Microchip Technology |
| 文件頁(yè)數(shù)： | 40/66頁(yè) |
| 文件大小： | 0K |
| 描述： | IC DSPIC MCU/DSP 132K 64TQFP |
| 產(chǎn)品培訓(xùn)模塊： | Serial Communications using dsPIC30F CAN Serial Communications using dsPIC30F I2C Serial Communications using dsPIC30F SPI Serial Communications using dsPIC30F UART dsPIC30F 12 bit ADC - Part 2 dsPIC30F Addressing Modes - Part 1 dsPIC30F Architecture - Part 1 dsPIC30F DSP Engine & ALU dsPIC30F Interrupts dsPIC30F Motor Control PWM dsPIC Timers Asynchronous Stimulus dsPIC30F Addressing Modes - Part 2 dsPIC30F Architecture - Part 2 dsPIC30F 12-bit ADC Part 1 |
| 標(biāo)準(zhǔn)包裝： | 160 |
| 系列： | dsPIC™ 30F |
| 核心處理器： | dsPIC |
| 芯體尺寸： | 16-位 |
| 速度： | 30 MIP |
| 連通性： | CAN，I²C，SPI，UART/USART |
| 外圍設(shè)備： | 欠壓檢測(cè)/復(fù)位，LVD，POR，PWM，WDT |
| 輸入/輸出數(shù)： | 52 |
| 程序存儲(chǔ)器容量： | 132KB（44K x 24） |
| 程序存儲(chǔ)器類型： | 閃存 |
| EEPROM 大小： | 2K x 8 |
| RAM 容量： | 6K x 8 |
| 電壓 - 電源 (Vcc/Vdd)： | 2.5 V ~ 5.5 V |
| 數(shù)據(jù)轉(zhuǎn)換器： | A/D 16x12b |
| 振蕩器型： | 內(nèi)部 |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | 64-TQFP |
| 包裝： | 托盤(pán) |
| 產(chǎn)品目錄頁(yè)面： | 651 (CN2011-ZH PDF) |
| 配用： | XLT64PT5-ND - SOCKET TRAN ICE 64MQFP/TQFP AC164319-ND - MODULE SKT MPLAB PM3 64TQFP DV164005-ND - KIT ICD2 SIMPLE SUIT W/USB CABLE |
| 其它名稱： | DSPIC30F6011A30IP |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)當(dāng)前第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)
2010 Microchip Technology Inc.
DS70102K-page 45
dsPIC30F Flash Programming Specification
11.8
Writing Code Memory
The procedure for writing code memory is similar to the
procedure for clearing the Configuration registers,
except that 32 instruction words are programmed at a
time. To facilitate this operation, working registers
W0:W5 are used as temporary holding registers for the
data to be programmed.
Table 11-8 shows the ICSP programming details,
including the serial pattern with the ICSP command
code, which must be transmitted Least Significant bit
first using the PGC and PGD pins (see Figure 11-2). In
Step 1, the Reset vector is exited. In Step 2, the
NVMCON register is initialized for single-panel
programming of code memory. In Step 3, the 24-bit
starting destination address for programming is loaded
into the TBLPAG register and W7 register. The upper
byte of the starting destination address is stored to
TBLPAG, while the lower 16 bits of the destination
address are stored to W7.
To minimize the programming time, the same packed
instruction format that the programming executive uses
is utilized (Figure 8-2). In Step 4, four packed
instruction words are stored to working registers
W0:W5 using the MOV instruction and the read pointer
W6 is initialized. The contents of W0:W5 holding the
packed instruction word data is shown in Figure 11-4.
In Step 5, eight TBLWT instructions are used to copy the
data from W0:W5 to the write latches of code memory.
Since code memory is programmed 32 instruction
words at a time, Steps 4 and 5 are repeated eight times
to load all the write latches (Step 6).
After the write latches are loaded, programming is
initiated by writing to the NVMKEY and NVMCON
registers in Steps 7 and 8. In Step 9, the internal PC is
reset to 0x100. This is a precautionary measure to
prevent the PC from incrementing into unimplemented
memory when large devices are being programmed.
Lastly, in Step 10, Steps 2-9 are repeated until all of
code memory is programmed.
FIGURE 11-5:
PACKED INSTRUCTION
WORDS IN W0:W5
15
8
7
0
W0
lsw0
W1
MSB1
MSB0
W2
lsw1
W3
lsw2
W4
MSB3
MSB2
W5
lsw3
TABLE 11-8:
SERIAL INSTRUCTION EXECUTION FOR WRITING CODE MEMORY
Command
(Binary)
Data
(Hexadecimal)
Description
Step 1: Exit the Reset vector.
0000
040100
000000
GOTO 0x100
NOP
Step 2: Set the NVMCON to program 32 instruction words.
0000
24001A
883B0A
MOV
#0x4001, W10
MOV
W10, NVMCON
Step 3: Initialize the write pointer (W7) for TBLWT instruction.
0000
200xx0
880190
2xxxx7
MOV
#<DestinationAddress23:16>, W0
MOV
W0, TBLPAG
MOV
#<DestinationAddress15:0>, W7
Step 4: Initialize the read pointer (W6) and load W0:W5 with the next 4 instruction words to program.
0000
2xxxx0
2xxxx1
2xxxx2
2xxxx3
2xxxx4
2xxxx5
MOV
#<LSW0>, W0
MOV
#<MSB1:MSB0>, W1
MOV
#<LSW1>, W2
MOV
#<LSW2>, W3
MOV
#<MSB3:MSB2>, W4
MOV
#<LSW3>, W5
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| PIC32MX695F512L-80I/BG | IC MCU 32BIT 512KB FLASH 121XBGA |
| PIC32MX775F512L-80V/BG | IC MCU 32BIT 512KB FLASH 121XBGA |
| PIC32MX795F512L-80I/PT | IC MCU 32BIT 512KB FLASH 100TQFP |
| PIC18LF6585-I/PT | IC PIC MCU FLASH 24KX16 64TQFP |
| PIC18LF6621-I/PT | IC PIC MCU FLASH 32KX16 64TQFP |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| dsPIC30F6011AT-20E/PT | 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC 20MIPS 132 KB RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT |
| DSPIC30F6011AT-20I/PT | 功能描述:IC DSPIC MCU/DSP 132K 64TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:dsPIC™ 30F 產(chǎn)品培訓(xùn)模塊:XLP Deep Sleep Mode 8-bit PIC® Microcontroller Portfolio 標(biāo)準(zhǔn)包裝:22 系列:PIC® XLP™ 18F 核心處理器:PIC 芯體尺寸:8-位 速度:48MHz 連通性:I²C，SPI，UART/USART，USB 外圍設(shè)備:欠壓檢測(cè)/復(fù)位，POR，PWM，WDT 輸入/輸出數(shù):14 程序存儲(chǔ)器容量:8KB（4K x 16） 程序存儲(chǔ)器類型:閃存 EEPROM 大小:256 x 8 RAM 容量:512 x 8 電壓 - 電源 (Vcc/Vdd):1.8 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 11x10b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:20-DIP（0.300"，7.62mm） 包裝:管件 產(chǎn)品目錄頁(yè)面:642 (CN2011-ZH PDF) 配用:DV164126-ND - KIT DEVELOPMENT USB W/PICKIT 2DM164127-ND - KIT DEVELOPMENT USB 18F14/13K50AC164112-ND - VOLTAGE LIMITER MPLAB ICD2 VPP |
| DSPIC30F6011AT-30I/PF | 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC 16-bit MCU/DSP 30MIPS 132KB RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT |
| dsPIC30F6011AT-30I/PT | 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC 30MIPS 132 KB RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT |
| DSPIC30F6011T-20E/PF | 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC 30MHz 132KB Flash RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。