參數(shù)資料
      型號(hào): DSPIC30F5013T-30I/PTG
      廠商: Microchip Technology
      文件頁(yè)數(shù): 34/66頁(yè)
      文件大小: 0K
      描述: IC DSPIC MCU/DSP 66K 80TQFP
      標(biāo)準(zhǔn)包裝: 1,200
      系列: dsPIC™ 30F
      核心處理器: dsPIC
      芯體尺寸: 16-位
      速度: 30 MIP
      連通性: CAN,I²C,SPI,UART/USART
      外圍設(shè)備: AC'97,欠壓檢測(cè)/復(fù)位,I²S,LVD,POR,PWM,WDT
      輸入/輸出數(shù): 68
      程序存儲(chǔ)器容量: 66KB(22K x 24)
      程序存儲(chǔ)器類型: 閃存
      EEPROM 大小: 1K x 8
      RAM 容量: 4K x 8
      電壓 - 電源 (Vcc/Vdd): 2.5 V ~ 5.5 V
      數(shù)據(jù)轉(zhuǎn)換器: A/D 16x12b
      振蕩器型: 內(nèi)部
      工作溫度: -40°C ~ 85°C
      封裝/外殼: 80-TQFP
      包裝: 帶卷 (TR)
      配用: DM300024-ND - KIT DEMO DSPICDEM 1.1
      XLT80PT3-ND - SOCKET TRAN ICE 80MQFP/TQFP
      AC164320-ND - MODULE SKT MPLAB PM3 80TQFP
      DM300004-2-ND - BOARD DEMO DSPICDEM.NET 2
      DM300004-1-ND - BOARD DEMO DSPICDEM.NET 1
      AC30F007-ND - MODULE SKT FOR DSPIC30F 80TQFP
      其它名稱: DSPIC30F5013T30I
      dsPIC30F Flash Programming Specification
      DS70102K-page 4
      2010 Microchip Technology Inc.
      3.0
      PROGRAMMING EXECUTIVE
      APPLICATION
      3.1
      Programming Executive Overview
      The programming executive resides in executive
      memory and is executed when Enhanced ICSP
      Programming mode is entered. The programming exec-
      utive provides the mechanism for the programmer (host
      device) to program and verify the dsPIC30F, using a
      simple command set and communication protocol.
      The following capabilities are provided by the
      programming executive:
      Read memory
      - Code memory and data EEPROM
      - Configuration registers
      -Device ID
      Erase memory
      - Bulk Erase by segment
      - Code memory (by row)
      - Data EEPROM (by row)
      Program memory
      - Code memory
      - Data EEPROM
      - Configuration registers
      Query
      - Blank Device
      - Programming executive software version
      The programming executive performs the low-level
      tasks required for erasing and programming. This
      allows the programmer to program the device by
      issuing the appropriate commands and data.
      The programming procedure is outlined in Section 5.0
      3.2
      Programming Executive Code
      Memory
      The programming executive is stored in executive code
      memory and executes from this reserved region of
      memory. It requires no resources from user code
      memory or data EEPROM.
      3.3
      Programming Executive Data RAM
      The programming executive uses the device’s data
      RAM for variable storage and program execution. Once
      the programming executive has run, no assumptions
      should be made about the contents of data RAM.
      4.0
      CONFIRMING THE CONTENTS
      OF EXECUTIVE MEMORY
      Before programming can begin, the programmer must
      confirm that the programming executive is stored in exec-
      utive memory. The procedure for this task is illustrated in
      First, ICSP mode is entered. The unique application ID
      word stored in executive memory is then read. If the
      programming executive is resident, the application ID
      word is 0xBB, which means programming can resume
      as normal. However, if the application ID word is not
      0xBB,
      the
      programming
      executive
      must
      be
      programmed to Executive Code memory using the
      Section 11.0 “ICSP Mode” describes the process
      for the ICSP programming method. Section 11.13
      procedure for reading the application ID word in ICSP
      mode.
      FIGURE 4-1:
      CONFIRMING PRESENCE
      OF THE PROGRAMMING
      EXECUTIVE
      Is
      Start
      Enter ICSP Mode
      Application ID
      0xBB?
      Resident in Memory
      Yes
      No
      Prog. Executive is
      Application ID
      Read the
      be Programmed
      Prog. Executive must
      from Address
      0x8005BE
      Finish
      相關(guān)PDF資料
      PDF描述
      DSPIC30F5013T-20I/PTG IC DSPIC MCU/DSP 66K 80TQFP
      DSPIC30F5011T-30I/PTG IC DSPIC MCU/DSP 66K 64TQFP
      DSPIC30F5011T-20I/PTG IC DSPIC MCU/DSP 66K 64TQFP
      MSP430F2370IRHAT IC MCU 16BIT 32K FLASH 40-QFN
      PIC18LF6621T-I/PT IC MCU FLASH 32KX16 64TQFP
      相關(guān)代理商/技術(shù)參數(shù)
      參數(shù)描述
      dsPIC30F5015-20E/PT 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC 20MIPS 66 KB RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
      dsPIC30F5015-20I/PT 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC 20MIPS 66 KB RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
      dsPIC30F5015-30I/PT 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC 30MIPS 66 KB RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
      dsPIC30F5015T-20E/PT 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC 20MIPS 66 KB RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
      DSPIC30F5015T-20I/PT 功能描述:IC DSPIC MCU/DSP 66K 64TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:dsPIC™ 30F 產(chǎn)品培訓(xùn)模塊:XLP Deep Sleep Mode 8-bit PIC® Microcontroller Portfolio 標(biāo)準(zhǔn)包裝:22 系列:PIC® XLP™ 18F 核心處理器:PIC 芯體尺寸:8-位 速度:48MHz 連通性:I²C,SPI,UART/USART,USB 外圍設(shè)備:欠壓檢測(cè)/復(fù)位,POR,PWM,WDT 輸入/輸出數(shù):14 程序存儲(chǔ)器容量:8KB(4K x 16) 程序存儲(chǔ)器類型:閃存 EEPROM 大小:256 x 8 RAM 容量:512 x 8 電壓 - 電源 (Vcc/Vdd):1.8 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 11x10b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:20-DIP(0.300",7.62mm) 包裝:管件 產(chǎn)品目錄頁(yè)面:642 (CN2011-ZH PDF) 配用:DV164126-ND - KIT DEVELOPMENT USB W/PICKIT 2DM164127-ND - KIT DEVELOPMENT USB 18F14/13K50AC164112-ND - VOLTAGE LIMITER MPLAB ICD2 VPP